Preparation technology of pressure sensitive adhesive tape for intelligent mobile phone

Abstract

The invention discloses a preparation technology of a pressure sensitive adhesive tape for an intelligent mobile phone. The preparation technology comprises the following steps of: step I, raising the temperature of a polyimide thin film from room temperature to 250 DEG C, performing heat preservation, raising the temperature to 400 DEG C, and then reducing the temperature to the room temperature; step II, coating a layer of a graphite modifying agent on the upper surface and the lower surface of the polyimide thin film obtained in the step I so as to obtain the treated polyimide thin film, wherein the stickiness of the graphite modifying agent is 30000-48000CP, and the graphite modifying agent is made from the following components in parts by weight: pyromellitic dianhydride, BTDA, diaminodiphenylmethane, dimethyl formamide, N-methylpyrrolidinone, glycol and polydimethylsiloxane; and step III, raising the temperature of the treated polyimide thin film to 800 DEG C, performing heat preservation, raising the temperature to 1200 DEG C, performing heat preservation, and then performing cooling so as to obtain a prefiring carbonization film. According to the preparation technology disclosed by the invention, the heat-conducting uniformity of the adhesive tape is realized, the heat dispersion stability and reliability of products are improved, and the cost of the products is greatly reduced.

Description

technical field [0001] The invention relates to a preparation process of a pressure-sensitive adhesive tape for smart phones, and belongs to the technical field of heat dissipation films. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, li...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness