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Brittle metal microspheres preparation method based on metal microspheres forming device

A brittle metal and forming device technology is applied to the preparation of brittle metal microspheres. By designing the field of metal microsphere forming devices, the problems of difficulty in manufacturing brittle metal microspheres, complicated mechanism and huge equipment can be solved, and the equipment is simple and the cost is achieved. Low, the effect of preventing metal oxidation

Active Publication Date: 2016-10-12
ZHUZHOU KENENG NEW MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Similar to the uniform droplet spraying method, this method is mainly used to prepare spherical particles smaller than 1mm, and it also has the disadvantages of large equipment, complicated mechanism, and high cost.
[0010] It can be seen that there are certain defects in the preparation methods of the above-mentioned existing metal balls, especially it is difficult to manufacture brittle metal microspheres of 1-4mm.

Method used

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  • Brittle metal microspheres preparation method based on metal microspheres forming device
  • Brittle metal microspheres preparation method based on metal microspheres forming device

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Embodiment 1

[0044] Once the compressed gas pressure, nozzle aperture and pulse gas frequency are determined according to the size of the metal ball to be manufactured (compressed gas pressure 0.5MPa, nozzle aperture 0.2mm, pulse gas frequency 50Hz), metal bismuth is placed in the melting chamber 3, heated Let it melt. The compressed gas is fed into the melting chamber 3 through the compressed gas inlet 1 , and the molten bismuth is ejected through the nozzle 2 .

[0045]After the molten bismuth is ejected, it is blown away from the nozzle 2 by the pulse gas fed through the pulse gas inlet 4, causing it to fall, thereby forming bismuth droplets. During the falling process, the bismuth droplet transforms into an almost perfect spherical shape due to surface tension, and after passing through the area where the cooling unit 8 is located, it is cooled and solidified (specifically ensure that the temperature in this area is below 0° C.) to form a metal bismuth ball. Then, the metal bismuth ba...

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Abstract

The invention discloses a brittle metal microspheres preparation method based on a metal microspheres forming device. The metal microspheres forming device comprises an upper melting chamber and a lower cavity body. The melting chamber is mainly used for melting brittle metal. The molten brittle metal is sprayed into the cavity body by a spray nozzle and cools, solidifies and forms in the cavity body. Prepared brittle metal microspheres are distributed uniformly in particle size with the range being between 1mm and 4mm and the morphology of the prepared brittle metal microspheres is in a standard sphere shape. The method is simple in equipment, strong in operability and capable of continuous production and meeting the industrial production requirements.

Description

technical field [0001] The invention relates to a method for preparing brittle metal microspheres, in particular to a method for manufacturing brittle metal microspheres by using surface tension by designing a metal microsphere forming device, and belongs to the field of metal material preparation. Background technique [0002] At present, metal balls are widely used in the field of machinery (bearing balls), electronic packaging (BGA tin balls, copper-tin core-shell particles), chemical catalysis (nickel-based alloy particles), etc. In order to meet the needs of the above fields, it is not only necessary to meet the requirements of uniform size and high sphericity, but also to meet the same thermal history of the preparation process. Therefore, there are still quite a lot of research at home and abroad devoted to the preparation technology of metal balls. [0003] The preparation methods of metal balls can be roughly divided into casting method, forging grinding method, shr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08
CPCB22F9/082B22F2009/0824B22F2009/086
Inventor 赵科湘赵家浩
Owner ZHUZHOU KENENG NEW MATERIAL CO LTD
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