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Power module integrated with radiator

An integrated heat sink and power module technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of large thermal resistance, performance degradation, and low thermal conductivity from the chip to the heat sink, and achieve Effects of reducing heat transfer paths, improving reliability, and simplifying structure

Active Publication Date: 2016-09-21
YANGZHOU GUOYANG ELECTRONICS CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] However, although thermally conductive silicone grease is relatively thin, it has low thermal conductivity and large thermal resistance, and thermally conductive silicone grease will gradually dry out with the increase of service time, further reducing its performance
The traditional power module structure and installation method make the thermal resistance from the chip to the heat sink larger and the efficiency lower, which cannot meet the requirements of miniaturization and high reliability of the power module

Method used

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  • Power module integrated with radiator
  • Power module integrated with radiator
  • Power module integrated with radiator

Examples

Experimental program
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Embodiment Construction

[0024] The technical solution is described in detail below by a preferred embodiment in conjunction with the accompanying drawings:

[0025] Such as figure 1 , figure 2 As shown, a power module with an integrated heat sink includes an insulating substrate 1. Since the heat dissipation device is integrated in the power module of the present invention, the insulating substrate 1 is easily deformed due to the pressure of the heat dissipation medium under the insulating substrate 1 of the power module during use. and weld fatigue. In order to avoid deformation of the insulating substrate 1 and premature fatigue failure of the welding layer 3, the insulating ceramic layer in the insulating substrate 1 is preferably Al with a thickness of 0.63mm or more. 2 o 3 , or AlN, or Si 3 N 4 , and for a large-area insulating substrate 1, it is recommended that the insulating substrate 1 be welded in different regions, that is, the shunt plate 4 is provided with more shunt beams 41; the ...

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Abstract

The invention discloses a power module integrated with a radiator. The power module integrated with the radiator comprises an insulation substrate, wherein the insulation substrate is provided with a chip set. The power module integrated with the radiator is characterized in that a lower portion of the insulation substrate is provided with a radiator base, the radiator base comprises a radiation medium inlet and a radiation medium outlet, and a radiation medium enters the radiator base from the radiation medium inlet, contacts with the bottom portion of the insulation substrate and flows out from the radiation medium outlet. The power module integrated with the radiator realizes integration of the power module and the radiator, a heat conduction silicone grease layer is omitted, heat transmission paths are reduced, the radiation medium can realize direct heat exchange with a metal layer below the insulation substrate, a secondary welding layer, a bottom board layer, a heat conduction silicone grease layer and a radiator of a traditional mounting structure are saved, not only can the structure be simplified, but also thermal resistance of the power module is reduced, and reliability of the power module is improved.

Description

technical field [0001] The invention relates to a power semiconductor module, in particular to a power module with integrated radiator. Background technique [0002] Energy conservation, emission reduction, and low-carbon development are global issues, and all countries have realized that development must be in harmony with the environment. With the establishment and promotion of green environmental protection in the world, the development and application prospects of power semiconductors are broader, which not only conforms to the current situation of my country's energy-intensive industries, but also meets the requirements of building a harmonious society and sustainable development. At present, the semiconductor power unit industry is developing rapidly, and the power density is continuously increasing. The performance and reliability of power modules are often closely related to heat dissipation. The traditional power module structure mainly includes a casing, an insula...

Claims

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Application Information

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IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 王玉林滕鹤松徐文辉
Owner YANGZHOU GUOYANG ELECTRONICS CO LTD
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