Accelerated degradation test based method and system for rapid prediction of PCB insulation life

Abstract

The present invention relates to a method and system for rapid prediction of PCB insulation life based on accelerated degradation tests. The prediction method includes the following steps: step S1, conducting bias stress accelerated degradation tests on multiple PCBs under high temperature and high humidity conditions, collecting various The surface insulation resistance value of the PCB; step S2, fitting the surface insulation resistance value of the PCB to obtain a performance degradation trajectory model, and calculating the pseudo-failure life of each PCB according to the performance degradation trajectory model; step S3, constructing a bias stress acceleration model , calculate the estimated parameters of the bias stress acceleration model according to the pseudo-failure life, and then obtain the insulation life of the PCB under different bias stresses under high temperature and high humidity conditions according to the bias stress acceleration model; step S4, construct the high temperature and high humidity conditions and insulation life A relational model of life, according to the relational model, the insulation life of the PCB at room temperature is obtained. The invention solves the problem of quickly predicting the life of PCB insulation within a limited time by building an acceleration model, and is especially suitable for the technical field of PCB reliability.

Description

technical field [0001] The invention relates to the technical field of PCB insulation life, in particular to a method and system for rapidly predicting PCB insulation life based on accelerated degradation tests. Background technique [0002] As the basic components of electronic equipment, printed circuit boards (PCB) skillfully realize the combination of circuit conduction and substrate insulation. They are widely used in the fields of computers, numerical control, and electronic instruments, and their status is very important. Among them, insulation reliability is one of the two major reliability of PCB, and its reliability level has become an important factor affecting the completion of established tasks of electronic equipment. The insulation properties of PCB are firstly related to the type of substrate. FR-4 epoxy glass cloth copper clad laminate, because of its good mechanical properties and dielectric properties, good heat resistance, and moderate cost, is used in pr...

AI Technical Summary

Problems solved by technology

[0006] In the existing evaluation technology, when evaluating the reliability of long-life products, a large amount of test time is required to collect failure data, which in turn increases the cost of prediction, and even some high-reliability products have no data failure or very little data within a certain test time failure, so its reliability cannot be accurately assessed

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