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A fingerprint recognition module and preparation method thereof

A fingerprint recognition module and speed control technology, which is applied in character and pattern recognition, fingerprint/palmprint acquisition/organization, print image collection, etc., can solve problems such as difficult color matching, easy scratches, and low surface hardness cost, solve the effect of easy falling off, and improve the yield rate

Active Publication Date: 2020-04-28
LENS TECH CHANGSHA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The surface hardness of the fingerprint identification module of the existing coating scheme is low, easy to scratch, and difficult to match colors, especially white highlights

Method used

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  • A fingerprint recognition module and preparation method thereof
  • A fingerprint recognition module and preparation method thereof
  • A fingerprint recognition module and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A. Use the UV wire drawing process to form the required texture on the glass surface: use the graphic transfer technology to form a 10μm wire drawing texture on the surface of the glass substrate (550mm*650mm, 0.2mm thickness), the specific steps:

[0044] 1) The UV glue is evenly distributed on the drawing template in a straight line, and the starting point is aligned with the left and right sides of the mold;

[0045] 2) The automatic UV film of the machine is used for UV glue pressing operation, the roller pressure is 0.4MPa, and the speed is 60mm / s;

[0046] 3) UV exposure curing, UV energy 2000mj / cm 2 ;

[0047] B. Using NCVM technology (non-conductive metal coating technology), a non-conductive metal film (such as silicon with a thickness of about 5 nanometers) is formed on the surface of the UV layer of the plain glass substrate;

[0048] C. By controlling the cutting depth and speed of the cutter wheel or controlling the energy and speed of the laser engraving...

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Abstract

The invention discloses a fingerprint recognition module and a preparation method thereof. The fingerprint recognition module includes a flexible circuit board, an inductor, a glass cover and a metal ring, and a UV layer and a non-conductive The metal film layer; the preparation method of the fingerprint recognition module: 1) bonding the flexible circuit board and the sensor through the surface sticking technology; 2) bonding the glass cover plate and the sensor through the glue bonding technology; 3) assembling the metal ring; The surface hardness of the fingerprint identification module reaches the standard, and the identification effect is good, which can meet special appearance requirements. The preparation method has the characteristics of high yield, cost reduction, and simplified process flow.

Description

technical field [0001] The invention relates to a fingerprint identification module and a preparation method thereof, belonging to the technical field of fingerprint identification. Background technique [0002] The two relatively mature solutions in the fingerprint recognition module market are the Coating solution and the CG bonding solution. The CG fitting scheme has a single appearance and cannot meet consumers' demand for high quality. The CG bonding solution is mainly to complete the drawing pattern on the CG surface, and to achieve the required appearance and higher SNR (sex-to-noise ratio) through electroplating and specific glue bonding. It has higher requirements for the bonding glue and the viscosity of the glue It needs to be controlled at 2000~20000cps, the ingredients need to be single, the particle size is less than 15um, and the shear strength after curing is more than 3Mpa / cm 2 , Laminating adhesive thickness <30um. The surface hardness of the fingerpr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306
Inventor 周群飞饶桥兵汤毅
Owner LENS TECH CHANGSHA
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