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Metal film etching liquid and method for etching printed circuit board

A technology for printed circuit boards and metal films, which is applied to printed circuits, printed circuit manufacturing, and removal of conductive materials by chemical/electrolytic methods. Etching speed is fast and the effect of reducing surface tension

Inactive Publication Date: 2016-09-07
SHENZHEN LEAGUER OPTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a metal film etching solution and an etching method for a printed circuit board, aiming to solve the technical problems of poor etching and slow etching speed of the metal film of a printed circuit board in the prior art

Method used

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  • Metal film etching liquid and method for etching printed circuit board
  • Metal film etching liquid and method for etching printed circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0074] The mass percent of each component of the metal film etching solution 30 is: 3% FeCl 3 , 4% HCl, 0.5% NaClO 3 , 0.001% surfactant and the balance water, and the surface tension is 30mN / m, the pH is 5.8, and the temperature is 38°C. The mass ratio of the metal in the etched metal film 12 is 90% copper and 10% nickel, and the etching time is 150s. After the etching is completed, the width difference between the lines is within 5 μm, which meets the process requirements.

Embodiment 2

[0076] The mass percent of each component of the metal film etching solution 30 is: 16% FeCl 3 , 17% HCl, 3.12% NaClO 3 , 0.18% surfactant and the balance water, and the surface tension is 40mN / m, the pH is 6.8, and the temperature is 45°C. The metal mass ratio in the etched metal film 12 is 70% copper, 10% zinc and 20% nickel, the etching time is 180s, and the width difference between lines after etching is within 5 μm, which meets the process requirements.

Embodiment 3

[0078] The mass percent of each component of the metal film etching solution 30 is: 8% FeCl 3 , 9% HCl, 1.25% NaClO 3 , 0.02% surfactant and the rest water, and the surface tension is 33mN / m, the pH is 6.1, and the temperature is 40°C. The mass ratio of the metal in the etched metal film 12 is 80% copper and 20% nickel, and the etching time is 120s. After the etching is completed, the width difference between the lines is within 4 μm, which meets the process requirements.

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Abstract

The invention relates to the technical field of manufacturing of printed circuit boards, in particular to metal film etching liquid and a method for etching a printed circuit board. The metal film etching liquid is prepared from, by mass percent, 3%-16% of FeCl3, 4%-17% of HCl, 0.5%-3.12% of NaClO3, 0.001%-0.18% of a surface active agent and the balance water. By means of the metal film etching liquid prepared through the formula and used for etching the printed circuit board, it can be guaranteed that a metal film of the printed circuit board is etched more finely, and the phenomenon of poor etching cannot happen; and the metal film etching liquid and the method are suitable for manufacturing of metal film forming circuit patterns of printed circuit boards of semiconductor devices, liquid crystal display devices, touch control products, IC cards and the like and have wider application prospects.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a metal film etchant and an etching method for a printed circuit board. Background technique [0002] With the development of the electronics industry, the number of printed circuit boards is also increasing rapidly. With its excellent electrical and thermal conductivity, copper is very closely related to our production and life, and is widely used in electrical, light industry, machinery manufacturing, construction industry, national defense industry and other fields. second only to aluminum. Copper is the most widely used and used in the electrical and electronic industries, accounting for more than half of the total consumption. Used in the manufacture of various cables and wires, motors and transformers, switches and printed circuit boards. In recent years, with the continuous advancement of VLSI process technology, the feature size of semicondu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/16C23F1/02H05K3/06
CPCC23F1/16C23F1/02H05K3/067
Inventor 黄亮蒋蔚陈凯黄受林黄海东
Owner SHENZHEN LEAGUER OPTRONICS
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