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Method for efficient FPC board division

A high-efficiency, board-splitting technology, applied in the processing of insulating substrates/layers, electrical components, printed circuit manufacturing, etc., can solve problems such as unfavorable cost savings, inconvenient use and maintenance, and heavy mold weight, to achieve improved processing Efficiency, reduction of equipment input costs, and the effect of reducing equipment input costs

Inactive Publication Date: 2016-08-24
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These advantages of FPC different from ordinary PCB determine that the single board area of ​​FPC is small in actual design and application. In order to facilitate subsequent PCBA processing, FPC often adopts the method of multi-panel board. FPC sub-board is different from PCB using CNC milling machine and V-cut Cutting machine splitting, because FPC is light and thin and extremely flexible, in the splitting process of FPC assembly factories, the punching splitting currently used requires a sufficient amount of tools to be installed on the upper and lower dies and upper dies of the punching machine for one-time punching There are multiple connection points on the entire FPC board, so as to achieve the purpose of separating the FPC single board from the whole board. The limitation of this method is that the area size of the punch mold is limited by the FPC. Combined with the FPC, it is generally a multi-joint board, and the weight of the mold is relatively heavy. It is not convenient for subsequent use and maintenance; and the tools installed on the upper mold will be damaged and aged with the passage of time, requiring the user to perform corresponding maintenance, which is not conducive to cost saving

Method used

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Embodiment Construction

[0015] A method for high-efficiency FPC board splitting. According to the FPC design data analysis of the FPC board-up method, the establishment of the FPC board-up template, according to the board-up template, the mold under the punch press is selected to support the FPC, and the FPC fixing method is set to prevent the appearance of the FPC during the board-breaking process. Displacement, set the mold on the punching machine and determine the installation direction and position of the tool, and set the moving track and step distance of the lower mold according to the punching tool set on the upper mold of the FPC panel template, and divide the FPC.

[0016] According to the above method, the present invention will be further described in conjunction with the accompanying drawings.

[0017] A method for high-efficiency FPC board splitting, which analyzes the FPC board-up method based on FPC design data, and establishes an FPC board-up template, wherein the Gerber file can be us...

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Abstract

The invention discloses a method for efficient FPC board division. The method belongs to the technical field of FPC assembly. The method provided by the invention comprises the steps that an FPC board splicing manner is analyzed and an FPC board splicing template is established according to FPC design data; according to the board splicing template, a punching machine lower die is selected for FPC supporting; a FPC fixation manner is disposed; FPC displacement is avoided during the board division; a punching machine upper die is disposed, and an installation direction and an installation position of a cutter are determined; and a moving track and a stepping distance of the lower die are set according to the stamping die cutter which is disposed by the FPC board splicing template on the upper die, so that the FPC board division can be completed.

Description

technical field [0001] The invention discloses a method for dividing boards, belongs to the technical field of FPC assembly, and in particular relates to a method for dividing boards of FPCs with high efficiency. Background technique [0002] FPC (Flexible Printed Circuit) is a printed circuit made of a flexible insulating substrate. Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. According to the characteristics of the material of the flexible circuit board and its wide application fields, in order to save volume more effectively and achieve a certain accuracy, the characteristics of three-dimensional space and thin thickness are better applied to digital products, mobile phones and notebook computers. These advantages of FPC different from ordinary PCB determine tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0052
Inventor 郭峰
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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