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Novel organosilicone pouring sealant

A new type of silicone potting compound, applied in the field of potting compound, can solve the problems of difficulty in meeting the requirements of electrical stability and life, unsatisfactory flammability, poor thermal conductivity of pure silicone potting compound, etc. Flame retardant, highly modified alumina filling, good overall performance

Inactive Publication Date: 2016-08-10
张学健
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of pure silicone potting compound itself is poor (the thermal conductivity is only 0.168 W / m K), and it is difficult to meet the requirements of the stability and life of electrical appliances for the densification and miniaturization of electronic components; at the same time, its flammability ( The limiting oxygen index is about 18%) and cannot meet the regulatory requirements of my country, Europe and the United States on the flame retardancy of electrical appliances

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1: A new type of silicone potting compound prepared by mixing the following components according to weight percentage:

[0020] 30 parts of base glue

[0021] Thermally conductive filler 55 parts

[0022] Flame retardant 14.2 parts

[0023] Auxiliary 0.8 parts.

Embodiment 2

[0024] Example 2: A new type of silicone potting compound prepared by mixing the following components according to weight percentage:

[0025] Vinyl silicone oil 35 parts

[0026] 1 part hydrogen silicone oil

[0027] Hexadecyltrimethoxysilane modified alumina 46 parts

[0028] Aluminum diethylphosphinate 17.4 parts

[0029] Platinum catalyst 0.4 parts

[0030] Inhibitor 0.2 part.

[0031] Wherein the above-mentioned cetyltrimethoxysilane modified alumina preparation method, the steps are as follows:

[0032] (1) Put 50 parts of alumina into an electric heating constant temperature blast drying oven, and dry at 105°C for 2-3 hours;

[0033] (2) Pour the dried alumina into a high-speed mixer, the mixer speed is 2000 r / min, dilute 10 parts of hexadecyltrimethoxysilane with 50 parts of organic reagents to a solution with a mass fraction of 20% , sprayed into a high-speed mixer under stirring, raised the temperature to 110°C and continued to stir for 30 min; baked at 110°C f...

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Abstract

The invention discloses a novel organosilicone pouring sealant which is preparing by mixing basic sizing materials, a thermal conducting filler, a fire retardant and additives. The novel organosilicone pouring sealant provided by the invention utilizes vinyl silicone oil and silicone oil containing hydrogen as the basic sizing materials, and hexadecyltrimethoxysilane modified aluminium oxide as the thermal conducting filler; proper amounts of the fire retardants are added, and the fire-retardant and insulated organosilicone pouring sealant with high thermal conductivity is prepared. Therefore, not only can high modified aluminium oxide filling be realized, but also the thermal conductivity of 2.12 W / m*K is provided; moreover, the fire retardant can play roles of fire retardant synergistic effect and smoke inhibition along with modified aluminium oxide, so as to provide good fire retardancy. The product has good comprehensive performance, so as to meet requirements of market development.

Description

technical field [0001] The invention relates to the field of potting glue, in particular to a novel silicone potting glue. Background technique [0002] Silicone potting adhesives are widely used in the field of sealing and packaging of electronic appliances because of their good high and low temperature resistance, weather resistance, corrosion resistance and electrical properties. However, the thermal conductivity of pure silicone potting compound itself is poor (the thermal conductivity is only 0.168 W / m K), and it is difficult to meet the requirements for the stability and life of electrical appliances in the design of densification and miniaturization of electronic components; at the same time, its flammability ( The limiting oxygen index is about 18%) and cannot meet the regulatory requirements of my country, Europe and the United States on the flame retardancy of electrical appliances. Therefore, it is of great significance for the development of modern electronics in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/06C09J11/04
CPCC09J183/04C08L2201/02C08L2203/206C09J11/04C09J11/06C08L83/04C08K9/06C08K2003/2227C08K5/5313
Inventor 张学健
Owner 张学健
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