Pattern electroplating production method for printed circuit board needed to be nickel-gold plated on whole board

Abstract

A pattern electroplating production method for a printed circuit board needed to be nickel-gold plated on the whole board comprises the following steps of (1) providing an electrolytic gold plate, wherein the electrolytic gold plate is a printed circuit board needed to be nickel-gold plated on the whole board; (2) forming an outer-layer dry film; (3) electroplating a pattern, in the pattern electroplating process, the electrolytic gold plate is sequentially subjected to the following steps of plate loading, oil removal, washing with three-level water, slight etching, washing with second-level water, plated copper pre-impregnation, copper plating, washing with second-level water, anti-oxidant processing, washing with one-level water and plate discharging, and in the anti-oxidant processing, the electrolytic gold plate is placed in an anti-oxidant pot loaded with an anti-oxidant agent and is immersed in a watermill loaded with a micro acid solution after discharging; (4) carrying out horizontal anti-oxidant processing; (5) plating nickel and gold; (6) etching an outer layer; and (7) carrying out outer-layer AOI. By the method, a copper surface is protected to be clean and is prevented from oxidized and polluted by watermark, and scrap caused by unfavorable gold after nickel-gold plated on the whole board is further prevented.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a pattern electroplating production method for a printed circuit board that needs to be electroplated with nickel and gold on the entire board. Background technique [0002] As the requirements of electronic products are getting higher and higher, the circuit boards of some high-precision instruments need to use electrohard gold as a surface treatment method. The corresponding process is generally electroplating copper on the pattern without tin plating, and directly plating nickel After the gold layer, the contour etching is performed to complete the line transfer and surface treatment. [0003] For copper plating without tin plating, the traditional process generally adopts the following two methods: (1) add copper plating cylinder to the electric gold wire, and complete copper plating and nickel gold plating on one line; Wire treatment as shown in the figure, and ...

AI Technical Summary

Problems solved by technology

However, although the former method can protect the copper from being oxidized by the air, the efficiency is low, the copper plating time is longer, and the production efficiency is reduced, while the latter method is easy to cause copper damage because it is not protected by the tin layer and cannot be ground. There are oxidation and watermarks on the surface, resulting in bad gold after electroplating, and the phenomenon of board scrapping, causing losses to the enterprise