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Preparation method for low-cost insulating phenolic resin laminated board resistant to moisture and heat

A phenolic resin, low-cost technology, used in pressure impregnation, manufacturing tools, wood processing appliances, etc., can solve the problems of high water absorption speed, high water absorption rate and high price, and achieve the effect of simple preparation process and easy processing.

Active Publication Date: 2016-07-20
NORTHEAST FORESTRY UNIVERSITY
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0007] The present invention aims to solve the technical problems of using birch and epoxy resin raw materials to prepare electrical laminates, the price is relatively high, high-quality birch resources are wasted, the water absorption rate is high, the water absorption speed is fast, and the insulation performance is reduced in a humid and hot environment, and the heat and humidity resistance is provided. Process for the preparation of low-cost insulating phenolic resin laminates

Method used

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  • Preparation method for low-cost insulating phenolic resin laminated board resistant to moisture and heat
  • Preparation method for low-cost insulating phenolic resin laminated board resistant to moisture and heat
  • Preparation method for low-cost insulating phenolic resin laminated board resistant to moisture and heat

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specific Embodiment approach 1

[0022] Specific implementation mode 1: The preparation method of heat and humidity resistant low-cost insulating phenolic resin laminate in this implementation mode is specifically carried out according to the following steps:

[0023] 1. Control the temperature at 45°C to melt phenol, add NaOH solution with a mass concentration of 40%, and react for 10 minutes; add the first batch of formaldehyde solution with a mass concentration of 37%, raise the temperature to 70°C to 75°C, add KH550, and then heat up to 80°C-85°C, react for 1 hour; then lower the temperature to 70°C-75°C, then add the second batch of formaldehyde solution with a mass concentration of 37%, raise the temperature to 80°C-85°C, react for 190-210min, then cool down to 40°C Below ℃, the material is discharged to obtain phenolic resin;

[0024] 2. Dry the poplar veneer, control the moisture content to 5% to 12%, and cool it down;

[0025] 3. Put the veneer obtained in step 2 into the dipping tank, put spacers b...

specific Embodiment approach 2

[0027] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the molar ratio of phenol to NaOH in step 1 is 1:0.1. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0028] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the molar ratio of phenol and the total addition amount of two batches of formaldehyde is 1: 2.1 in the step one, wherein the addition amount of the first batch of formaldehyde solution is the same as that of the second batch The mass ratio of formaldehyde solution addition is 4:1. Others are the same as in the first or second embodiment.

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Abstract

The invention provides a preparation method for a low-cost insulating phenolic resin laminated board resistant to moisture and heat, and relates to the preparation method of the phenolic resin laminated board. The preparation method aims at solving the technical problems that at present, electrician laminated wood prepared from birch and epoxy resin raw materials is relatively high in price, high-quality birch resources are wasted, and under the moist and hot environment, the water absorption is high, the water absorption speed is high and insulativity is reduced. The method includes the steps that firstly, phenolic resin is prepared; secondly, poplar veneer is dried and cooled; thirdly, the poplar veneer is soaked in modified resin to be processed; and fourthly, the processed veneer is dried, pre-pressed and hot-pressed. The preparation method is low in production cost, the water absorption of the prepared laminated wood board under the moist and hot environment is effectively reduced, and therefore the moist and hot ageing of laminated wood is slowed down, and the laminated board can have the lasting insulating property. The preparation method is used for preparing the low-cost insulating phenolic resin laminated board resistant to moisture and heat.

Description

technical field [0001] The invention relates to a method for preparing a phenolic resin laminate. Background technique [0002] The development of electrical laminated wood has a long history, but facing the tense situation of timber resources, artificial forests have become the main species to ease the supply and demand of timber at home and abroad. At present, the production of electrical laminated wood mainly uses birch and epoxy resin as raw materials, which not only wastes resources, but also costs a lot. Fast-growing poplar has the characteristics of fast growth, high yield, and short harvesting cycle, and has good utilization prospects. However, poplar has poor material quality, low density and surface hardness, which limits its application range. The wood modification method is to improve plantation An effective approach to the physical and chemical properties of wood. [0003] Li Yan et al used melamine impregnated modified poplar to improve the dimensional stabil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27K3/08B27K3/34C08G8/28
CPCB27K3/08B27K3/34C08G8/28
Inventor 王伟宏魏强
Owner NORTHEAST FORESTRY UNIVERSITY
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