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A hardware and software cooperation method for measuring cloud height and thickness

A cloud layer and height technology, which is applied in the field of improving the measurement accuracy of cloud layer height, can solve problems such as difficult observation interference and cloud layer reflection, and achieve the effect of strong processing system, higher flexibility, and faster speed

Active Publication Date: 2018-02-02
NANJING UNIV OF INFORMATION SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Applying the TDC time-to-digital conversion method simply relies on the conversion of the TDC chip, it is difficult to observe the interference and reflection of the cloud, and relies on the TDC time chip

Method used

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  • A hardware and software cooperation method for measuring cloud height and thickness
  • A hardware and software cooperation method for measuring cloud height and thickness
  • A hardware and software cooperation method for measuring cloud height and thickness

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0031] like figure 1Shown, a kind of hardware device of measuring cloud layer height and thickness is characterized in that, comprises FPGA, and described FPGA connects laser drive module, signal receiving module, signal conversion module, liquid crystal display module and off-chip flash memory module respectively, and described laser The drive module is connected to a laser transmitter, the laser transmitter is a 905nm laser transmitter, the signal receiving module includes a PIN photoelectric sensor, an ADC module and a broadband signal conditioning module, the PIN photoelectric sensor is connected to a broadband voltage conditioning module, and the broadband The voltage conditioning module i...

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Abstract

The invention discloses a hardware and software cooperation method for measuring cloud layer height and thickness. The method comprises the following steps: automatic emission and automatic collection of a high speed laser pulse train are realized, and collected discrete data are stored in an FPGA and then processed via an embedded processor. According to the hardware and software cooperation method, the high speed FPGA is used for pulse emission and data collection, speed higher than that of other hardware systems can be realized, and off-chip resources can be saved. According to the hardware and software cooperation method, a curvature segmentation and wavelet filtering method is adopted and is greater than a single value calculating method in terms of real-time performance, flexibility and measuring precision. Compared with the prior art, a high speed FPGA-based cloud layer height and thickness measuring instrument is advantaged by high speed, strong processing performance, monolithic integration, no need for redundant peripheral chips, capability of making it convenient to make an SOPC and realize chunked transplant, application to continuous, wireless and remote measurement, and wide application to the various fields such as meteorology, civilian use, transportation and the like.

Description

technical field [0001] The invention belongs to the technical field of meteorological detection, and relates to a hardware and software cooperation method for measuring the height and thickness of clouds, in particular to a hardware method based on high-speed FPGA characteristics and adopting extremely steep pulse rising edges and full optical path data acquisition and according to curvature A software method for improving the measurement accuracy of cloud height by segmentation and fast wavelet filtering. Background technique [0002] Cloud height and thickness measurement is a kind of analysis method established by applying optical principles, electronic sensors and processing technology, and using the relationship between high-energy pulse emission and reception time difference to measure distance. The cloud height and thickness measuring instrument based on high-speed FPGA is characterized by fast speed, strong processing system, single-chip integration, no need for redu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01S17/10G01S17/95G01S7/48
CPCG01S7/4808G01S17/10G01S17/95Y02A90/10
Inventor 吕雪驹唐慧强
Owner NANJING UNIV OF INFORMATION SCI & TECH
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