Manufacturing method for PCB electroplated with thick-gold partially

Abstract

The invention relates to the technical field of circuit board production, and specifically a manufacturing method for a PCB electroplated with thick-gold partially. According to the manufacturing method, an outer layer circuit pattern is plated with copper in a flash plating manner before the outer layer circuit pattern is electroplated with tin, and the thickness of the copper layer plated in the flash plating manner is controlled to be 2-5[mu]m; the problem of color difference in the junction of the thick-gold position and other circuits can be solved, and meanwhile, the problem of the over-small pore diameter of a metalized pore in the multi-layered board caused by over-thick copper layer can be solved as well; in addition, the outer layer circuit pattern is electroplated with copper and tin; the multi-layered board can be subjected to conventional preprocessing in the tin electroplating process to remove the board surface tension of the multi-layered board so as to effectively prevent little bubbles from remaining in a contact region between a dry film and a windowed copper surface; therefore, the problem that the outer layer circuit pattern has a nick caused by the fact that tin cannot be electroplated on the outer layer circuit pattern is solved, and the quality of the finished product can be well ensured; the copper in the processes of electroless-copper-plating and full-board electroplating is plated based on the copper thickness requirement of the finished product outer layer circuit, so that the thickness difference between the thick-gold position and other copper surfaces can be reduced in the manufacturing process, and diffusion coating can be avoided consequently.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for making a partially electroplated thick gold PCB. Background technique [0002] Electroplating thick gold on PCB can improve the conductivity, solderability and stability of PCB, etc. Existing methods for partial thick gold plating on PCB mainly include separate copper plating process and whole board copper plating process. The separate copper plating process is generally as follows: pre-process → copper sinking and full-board electroplating → one outer layer pattern (making thick gold pattern) → electroplating nickel gold on thick gold pattern → electroplating thick gold on thick gold pattern → one film fade →Secondary outer layer pattern (making outer layer circuit pattern)→Copper tin electroplating on the outer layer circuit pattern→Outer layer etching→Outer layer AOI→Post process. A separate copper plating process is used to make a PCB with part...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the current method of making partial electroplated thick gold PCB is very prone to seepage or pinholes on the copper surface and color difference at the co