Vacuum-sealed structure and manufacturing method thereof

Abstract

The invention discloses a vacuum seal structure and a manufacturing method thereof. The vacuum seal structure comprises a seal shell (2), a potting adhesive (6) and a seal device (7), wherein the seal shell (2) comprises a chamber; the chamber comprises a lateral wall and an open end and is used for accommodating an air escape element (1); the potting adhesive (6) is filled into the chamber of the seal shell (2) and coats the air escape element (1); and the seal device (7) is used for sealing the open end of the chamber of the seal shell (2) and is in tight contact with the potting adhesive (6) and the lateral wall of the seal shell (2). A liquid low-melting point alloy covers the potting adhesive (6) and forms the seal plate (71) as the seal device (7) after being cooled and solidified. The vacuum seal structure can prevent a nonmetal seal element from escaping air to generate harmful air; the wall thickness of the vacuum seal structure is reduced; the air escape area of the vacuum seal structure is reduced; and the possibility of a residual gas is reduced.

Description

technical field [0001] The invention relates to a vacuum sealing structure, which is especially suitable for the vacuum sealing structure of an extreme ultraviolet lithography board-level electronic system. Background technique [0002] Extreme ultraviolet lithography (EUVL) is currently the most promising lithography technology in the world, which can meet the mass production of IC nodes below CD14nm. Since most gases absorb 13.5nm extreme ultraviolet light, especially hydrocarbons, water vapor and other gases decomposed under the action of extreme ultraviolet light, it will cause carbon deposition and oxidation of the multilayer film on the surface of the extreme ultraviolet mirror, which will affect the reflection rate, so it is necessary to provide a clean vacuum environment for the lithography machine. [0003] There are a large number of board-level electronic systems inside the extreme ultraviolet lithography machine. The PCB board and electronic components will rele...

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Problems solved by technology

[0005] The invention is a vacuum sealing structure of a board-level electronics system, which is mainly used to solve the following technical problems: (1) When the existing vacuum sealing structure adopts non-metallic sealing components, the non-metallic sealing components themselves deflate to generate polluting gas , thereby polluting the vacuum cavity; (2) When the existing vacuum sealing structure adopts metal sealing components, the flange wall thickness is too large

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