Pretreatment solution for electroless plating and electroless plating method

一种前处理液、无电电镀的技术，应用在液态化学镀覆、金属材料涂层工艺、涂层等方向，能够解决限制、处理步骤多、触媒核脱离等问题

Active Publication Date: 2016-05-25
EEJA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the method of using metal ions has the disadvantages of increasing the number of processing steps and limiting the applicable electroless plating bath. Therefore, it is considered to reduce the noble metal salt in the pretreatment solution so that the formed noble metal colloid particles are adsorbed on the substrate. The method on the material (patent document 2 mentioned later)
[0006] However, the previous precious metal colloidal solution is easily affected by acid or alkali, the nanoparticles in the precious metal colloidal solution agglomerate, or the catalyst core is detached into the electroless plating, resulting in the abnormal precipitation of the electroplating film. At the same time, the electroless plating bath The problem of losing control and destroying it once

Method used

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  • Pretreatment solution for electroless plating and electroless plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Dissolve 0.1 g / L sodium tetrachloroaurate (III) tetrahydrate and 1.0 g / L xylitol in an aqueous sodium hydroxide solution (pH = 12 ), and reduced with trisodium citrate dihydrate to obtain gold (Au) colloidal solution. The average diameter of gold (Au) nanoparticles is 20nm, and more than 90% of them are in the range of 10-30nm (d=20±10nm). Gold (Au) nanoparticles with a particle diameter of 20 nm were observed with a transmission electron microscope (JEM-2010 manufactured by JEOL Ltd.). figure 1 A transmission electron microscope image is shown. It can be clearly seen from this figure that on the surface of the gold (Au) nanoparticles, the phycoclusters are automatically aligned at equal intervals with a size close to the atomic level of gold (Au).

[0060] Next, the obtained gold (Au) colloidal solution was dispersed in 80°C aqueous solution of 1 prescribed hydrochloric acid, sulfuric acid and potassium hydroxide, and similarly observed with a transmission electron m...

Embodiment 2

[0062] In the same manner as in Example 1, the gold (Au) conversion concentration of sodium tetrachloroaurate (III) tetrahydrate was changed to 1 g / L, 5 g / L and 9 g / L, and the concentration of xylitol was changed to Change to 15g / L, 0.5g / L and 150g / L. The particle diameters of the obtained gold (Au) nanoparticles are respectively d=20±10nm, d=30±10nm and d=50 with respect to the gold (Au) conversion concentration of 1g / L, 5g / L and 9g / L ±20nm.

Embodiment 3

[0064] Use mannitol, glycerol or erythritol instead of xylitol to carry out the same experiment as in Example 1, and obtain gold (Au) colloids of d=20±10nm, d=20±10nm and d=20±10nm respectively Nanoparticles. In the same manner as in Example 1, the resulting gold (Au) colloidal solution was dispersed in an 80°C aqueous solution of 1 regulated hydrochloric acid, sulfuric acid and potassium hydroxide, and in the same manner as in Example 1, no gold (Au) nanoparticles were observed. The surface properties of the particles change.

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Abstract

[Problem] The purpose of the present invention is to provide: a pretreatment solution which enables the formation of a fine circuit on the surface of a non-conductive substance and the formation of a thin film having a uniform film thickness over a wide area; and an electroless plating method using the pretreatment solution. [Solution] A pretreatment solution for electroless plating according to the present invention is characterized by being composed of noble metal colloidal nanoparticles, a sugar alcohol and water, and is also characterized in that: the colloidal nanoparticles are formed of gold (Au), platinum (Pt) or palladium (Pd); the colloidal nanoparticles have an average particle diameter of 5-80 nm; the colloidal nanoparticles are contained in the pretreatment solution in an amount of 0.01-10 g / L in terms of metal mass; and the sugar alcohol is composed of one or more substances selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol and pentaerythritol, said substances being contained in the pretreatment solution in an amount of 0.01-200 g / L in total. An electroless plating method according to the present invention is characterized by performing electroless plating in an electroless plating bath with use of the pretreatment solution.

Description

technical field [0001] The present invention relates to a kind of pretreatment liquid used in electroless plating (Electrolessplating) pretreatment, and the electroless plating method using said pretreatment liquid; A circuit and a pretreatment solution capable of forming a thin film with a uniform film thickness over a wide range, and an electroless plating method using the pretreatment solution. Background technique [0002] In the past, electroplating was used to directly form base metals (base metals) such as nickel (Ni), copper (Cu), cobalt (Co) or base metal alloys on the surface of the substrate, or silver (Ag), gold (Au), platinum ( As a method of coating a noble metal such as Pt), palladium (Pd) or a noble metal alloy, electroless plating is widely used industrially. Substrates for electroless plating include various compositions such as metals, plastics, ceramics, organic compounds, and cellulose. Specifically, polymer resins such as cellulose, raw silk, or polyes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/20
CPCC23C18/1889C23C18/1841C23C18/1608C23C18/1612C23C18/182C23C18/1868C23C18/30C23C18/32C23C18/42C23C18/44C23C18/18C23C18/20C23C18/204C23C18/1633C23C18/31
Inventor 伊东正浩足达勇一
Owner EEJA LTD
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