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Hybrid fingerprint acquisition chip and acquisition method

A fingerprint collection and chip technology, which is applied in printing image collection, acquisition/organization of fingerprints/palmprints, detection of living finger shapes, etc., can solve the problems of singleness, finger residue, anti-interference, etc.

Inactive Publication Date: 2016-05-25
成都费恩格尔微电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a multi-mode fingerprint collection chip and a collection method thereof, which can effectively solve the above-mentioned singleness, finger residue, anti-interference, fake finger identification and collection quality problems

Method used

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Embodiment Construction

[0079] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings. It should be noted that the present invention will be described in detail below with reference to the accompanying drawings, and the present invention will be illustrated through embodiments, but the present invention is not limited to the embodiments of the present invention.

[0080] see figure 2 , figure 2 It is a schematic structural diagram of the multi-mode fingerprint sensor chip of the present invention. As shown in the figure, the multi-mode fingerprint collection chip 2 includes: a two-dimensional sensing unit array 20 of MXN, consisting of MXN sensing units 201, wherein M and N are both integers greater than 1; a passivation insulating layer directly Covering on the sensing unit array 20; the polyester compound insulating layer is directly covered on the passivation insulating layer; the scan controller 22 is used to co...

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Abstract

The invention provides a multi-mode fingerprint acquisition chip and acquisition method. The chip comprises a two-dimensional sensing unit array with M rows and N columns, a passivation insulating layer which directly covers the two-dimensional sensing unit array, a polyester composite insulating layer which covers the passivation insulating layer, a scanning controller which allows M sensing units to scan effectively from top to bottom or from bottom to top, a driving circuit which provides a time sequence control signal needed by a sensing unit, an ADC array which is configured next to or above a sensing electrode, a buffer shift register, a mode control circuit which controls the working mode of the chip, an antenna metal frame, an RF driving circuit, a detection electrode for detecting a fake finger and a fake finger detection electrode. The parameter of the circuit is controlled through a host machine configuration mode, the multi-mode finger detection and collection can be realized by the chip, different working modes are selected according to different application occasions, thus the chip is more flexible and convenient, a fake finger can be effectively rejected through the fake finger detection electrode, thus the security of fingerprint information is improved.

Description

technical field [0001] The present invention relates to the field of integrated circuit design, in particular to a chip for hybrid fingerprint collection and a collection method thereof. Background technique [0002] As people's requirements for information security are getting higher and higher, living biometric authentication and identification are more and more used in people's daily life. Fingerprint authentication has high reliability and cost-effectiveness in biometric authentication, and has become the mainstream of current biometric authentication. At the same time, fingerprint acquisition technology is also developing rapidly. A fingerprint sensor with lower cost, small size, low power consumption and high dynamic range will occupy a huge market. Therefore, the fingerprint sensor with the above advantages has become the focus of current research, among which Capacitive fingerprint sensors have become one of the current mainstream products. [0003] With the gradua...

Claims

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Application Information

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IPC IPC(8): G06K9/00
CPCG06V40/1382G06V40/1306
Inventor 吴磊黄昊徐启波
Owner 成都费恩格尔微电子技术有限公司
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