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Polyimide nano composite containing fluorene or fluorenone structure and preparation method and application of polyimide nano composite

A technology of nanocomposite materials and polyimide, which is applied in the field of material science to achieve the effects of various preparation processes, low condition requirements, and simple preparation processes

Active Publication Date: 2016-05-25
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are few studies on polyimide nanocomposites reinforced with layered nanoparticles containing high planar structures such as fluorene or fluorenone. Therefore, it is necessary to carry out research on such polyimide nanocomposites

Method used

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  • Polyimide nano composite containing fluorene or fluorenone structure and preparation method and application of polyimide nano composite
  • Polyimide nano composite containing fluorene or fluorenone structure and preparation method and application of polyimide nano composite
  • Polyimide nano composite containing fluorene or fluorenone structure and preparation method and application of polyimide nano composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] At room temperature, under an argon atmosphere, 0.20g of mica (Mica) was sonicated in 43.51g (46.1ml) of N,N-dimethylformamide for 1h, and then 4.3450g (0.01mol) of N 2 ,N 7 -bis(4-aminophenyl)-9H-fluorene-2,7-dicarboxamide (FAPDA) and 2.1812g (0.01mol) 1,2,4,5-Benzenetetracarboxylicanhydride (1,2,4,5-pyromellitic acid di Anhydride, PMDA) was added to N,N-dimethylformamide with a solid content of 13%, and stirred for 6 hours to obtain a homogeneous and viscous polyamic acid / mica composite glue. Then scrape and coat the polyamic acid / mica composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the temperature rise program is: the room temperature is raised to 100°C and then the temperature is kept constant for 1h→100°C to 200°C After ℃, the whole process of constant temperature is 1h→200℃ to 300℃, the whole process of constant temperature is 1h→300℃, and then the whole process is constant for 1.5h. After cooling, the polyimide / mica...

Embodiment 2

[0038] At room temperature, under argon atmosphere, 0.18g montmorillonite (MMT) was sonicated in 45.51g (48.8ml) N,N-dimethylformamide for 2h, and 4.78g (0.01mol) 1,1'- (9-oxo-9H-fluorene-2,7-diyl)bis(3-(4-aminophenyl)urea)(FUPDA) and 2.1812g(0.01mol)1,2,4,5-Benzenetetracarboxylicanhydride(1,2, 4,5-Pyromellitic dianhydride, PMDA) was added to N,N-dimethylformamide with a solid content of 13%, and stirred for 6 hours to obtain a homogeneous viscous polyamic acid / montmorillonite composite Glue. Then scrape and coat the polyamic acid / montmorillonite composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the temperature rise program is: the room temperature is raised to 100°C, and then the temperature is kept constant throughout the process for 1h→100°C. After reaching 200°C, the whole process of constant temperature is 1h→200°C to 300°C, the whole process of constant temperature is 1h→300°C, and then the whole process is constant for 1.5h....

Embodiment 3

[0041] At room temperature, under an argon atmosphere, 0.03g graphene oxide (GO) was ultrasonicated in 49.92g (52.85ml) N,N-dimethylformamide for 6h to obtain a graphene oxide dispersion. At the same time, 5.3068g ( 0.01mol) N 1 ,N 1 '-((9H-fluorene-2,7-diyl)bis(4,1-phenylene))bis(benzene-1,4-diamine)(FPIPDA) and 2.1812g (0.01mol)1,2,4,5 -Benzenetetracarboxylicanhydride (1,2,4,5-pyromellitic dianhydride, PMDA) was added to N,N-dimethylformamide with a solid content of 13%, and stirred for 6 hours to obtain a homogeneous viscous polymer Amic acid glue, and then pour the graphene oxide dispersion into the polyamic acid glue to obtain polyamic acid / graphene oxide composite glue. Then scrape and coat the polyamic acid / graphene oxide composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: after the room temperature is raised to 100°C, the temperature is kept constant throughout the process for 1h→100°C. Af...

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Abstract

The invention discloses a polyimide nano composite containing a fluorene or fluorenone structure and a preparation method and application of the polyimide nano composite. The preparation method includes: adopting aromatic diamine having high planarity and containing a fluorene or fluorenone structure, various tetracid dianhydride and layered nanoparticles as raw materials for reaction to obtain polyimide nano composite gel; imidizing to obtain the polyimide nano composite. The aromatic diamine has high planarity and rigidity, so that polyimide prepared has small free area; seepage path prolonging effect of the layered nanoparticles are combined, so that the polyimide nano composite has excellent blocking performance, thermostability and excellent comprehensive performance. The preparation method is simple and diverse, thereby being suitable for industrial production. The polyimide nano composite can be applied to the field of high and new technology industries like high-performance packaging and protecting and electronic device encapsulating.

Description

technical field [0001] The invention relates to the field of material science, in particular to a polyimide nanocomposite material containing a fluorene or fluorenone structure and a preparation method and application thereof. technical background [0002] With the continuous development of science and technology, flexible electronic devices that use flexible polymers as substrates and packaging layers have emerged. The most representative flexible electronic devices are organic electroluminescent devices (OLED) and organic solar cells (OPV). However, one of the main reasons limiting their rapid development is that the performance of flexible polymer materials cannot meet their normal use and long service life, mainly in insufficient heat resistance, poor thermal dimensional stability, and more importantly, their barrier properties. The performance cannot meet the demanding requirements of flexible organic electronics. Due to the surface area effect, quantum size effect and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/34C08K3/04
CPCC08G73/1007C08G73/1067C08G73/1071C08K3/04C08K3/34C08K3/346
Inventor 刘亦武柳俊杰谭井华曾义张然王倩魏珊珊张海良刘跃军
Owner HUNAN UNIV OF TECH
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