Figure optimization method of surface acoustic wave filter chip after lift-off process

Abstract

The present invention discloses a figure optimization method of a surface acoustic wave filter chip after a lift-off process. The method comprises the concrete steps: corrosive liquid is uniformly distributed at the surface of a wafer and is configured to corrode the wafer figure, wherein the temperature of the corrosive liquid is maintained in the range of 22 DEG C to 24 DEG C and the rotation speed of a clamp is 1500 rpm+_ 50 rpm; the corrosive liquid or deionized water are configured to scour the surface of the chip through adoption of a centrifugal force generated by rotation of the clamp; the corrosion time is in the range of 60s to 90s, the corrosive liquid is configured to clean the chip, and when the corrosion time is up, the corrosive liquid is closed and the deionized water is opened to clean the chip; and the cleaning and the drying are performed after the corrosion is end, and the figure optimization of the surface acoustic wave filter chip after the lift-off process is completed. According to the invention, the center frequency of a surface acoustic wave filter chip is enhanced, and the reverse offset, of uniform line width caused in the process of photoetching development, is performed; and moreover, the reliability of surface acoustic wave filter products is improved.

Description

technical field [0001] The invention relates to a chip pattern optimization method after photolithography stripping, in particular to a pattern optimization method after surface acoustic wave filter chip stripping process. Background technique [0002] The surface acoustic wave filter is a kind of metal finger electrode made on the surface of the piezoelectric wafer, and the function of electrical signal processing is realized by using the electric-acoustic-electric conversion of the surface acoustic wave filter chip by applying power to the electrode. In the manufacturing process of surface acoustic wave filter chips, photolithography stripping process is often used to make chip patterns. Soaking combined with ultrasonic vibration stripping completes chip graphics production, and the quality of chip graphics molding directly affects the electrical performance parameters of the surface acoustic wave filter. In the traditional SAW filter production process, defects such as b...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a pattern optimization method after chip stripping process of surface acoustic wave filter, which solves the problem of edge burrs after chip pattern stripping, surface metal debris contamination, poor uniformity of chip line width after development, and making the thinnest line width. Problems smaller than the resolution of the lithography machine