Rigid-flex board with pad in flexible area and manufacturing method thereof

Abstract

The invention discloses a rigid-flex PCB with a flexible region equipped with a solder pad and a manufacturing method thereof. The manufacturing method includes the steps that raw materials of a pre-process flexible board, a PP prepreg and a rigid board are manufactured, manufacturing of internal wiring of the flexible board is completed to a quick pressing cover film, laser winding processing and quick pressing adhesive resistance processing of the cover film are performed on the cover film, and the flexible board with a copper solder pad and the prepreg and the rigid board are laminated together from the top to the bottom in turn and then transferred to a board lamination pressing process to perform total pressing processing; after total pressing processing is completed, the process goes to an external layer solder resistance process according to the conventional process; then flexible board region de-cap processing and manufacturing a flexible board framework are performed, the copper surface is cleaned by an abrasive blasting mode, and then internal and external solder pad synchronous gold immersion processing is performed on the flexible region solder pad and an external solder pad; and finally CNC rigid board formation processing is performed on a rigid board framework so that a finished board meeting the profile dimension required by a client can be obtained. The rigid-flex PCB with the flexible region equipped with the solder pad and the manufacturing method thereof have advantages of being concise in flow, low in cost and environment-friendly and pollution-free without skip plating in gold immersion.

Description

technical field [0001] The invention relates to the technical field of manufacturing a rigid-flexible printed circuit board, in particular to a rigid-flexible board with solder pads in a flexible region. Background technique [0002] Along with the demand for miniaturization and three-dimensional assembly of electronic products, rigid-flex boards have developed rapidly in recent years; at the same time, in order to cope with the more stringent miniaturization development trend, some products have tried to design pads in the flexible bending area. To reduce the pressure of rigid board mounting. For this type of rigid-flex board with pads in the flexible board area, the traditional method of immersion gold in the flexible part is to complete the pre-process treatment first, that is, the inner layer of the flexible board is made by cutting, drilling, and internal wiring. The cover film needs to be quickly pressed after the production of the flexible board circuit, and the loca...

AI Technical Summary

Problems solved by technology

For this type of rigid-flex board with pads in the flexible board area, the traditional method of immersion gold in the flexible part is to complete the pre-process treatment first, that is, the inner layer of the flexible board is made by cutting, drilling, and internal wiring. The cover film needs to be quickly pressed after the production of the flexible board circuit, and the local inner flexible board is immersed in gold once before entering the total pressure. When the soft board is gold-immersed, on the one hand, it needs to be protected by a dry film before the gold-immersion treatment , this dry film has insufficient chemical resistance and is easy to dissolve during immersion in nickel and gold, and pollutes the bath solution, which affects the service life of the bath solution. This is time-consuming and labor-intensive. Furthermore, soft boards usually immerse gold in the IC or gold fingers, and their load area is small, so it is easy to miss plating when immersion in nickel or gold.

After the flexible board, prepreg and rigid board enter the total pressure process and complete the total pressure, surface treatment is required to immerse gold once, plus the local gold immersion once completed before the total pressure, a total of 2 gold immersion, with many consumables, high cost

The traditional method of immersion gold for soft boards is cumbersome. During the process, many manual processes such as pasting traction boards, tapes, and protective frames are required. The overall efficiency is low and it is not conducive to mass production.

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