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Coaxial laser bonding wire fixture device

A technology of coaxial lasers and welding wire fixtures, which is applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve the problems of cumbersome use and achieve the effects of improving production efficiency, realizing precise positioning, and simple operation

Inactive Publication Date: 2016-03-23
CHONGQING BEIHUA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a coaxial laser welding wire fixture device, which is used to solve the problem that the fixing method of the welding wire fixture device in the prior art is locked by screws, the use is cumbersome, and the video work efficiency problem

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  • Coaxial laser bonding wire fixture device
  • Coaxial laser bonding wire fixture device
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Embodiment Construction

[0029] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0030] see Figure 1 to Figure 4 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...

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Abstract

The invention provides a coaxial laser bonding wire fixture device, which comprises a substrate base and a positioning cover plate, wherein the substrate base is provided with a bottom surface with a cavity to enable the substrate base to be matched with the original equipment working platform, and negative pressure through holes are uniformly distributed between the surface of the substrate base and the cavity; two sides of the positioning cover plate are provided with positioning mechanisms, the size of the positioning cover plate and the size of the substrate base are matched, the two are fixed via the positioning mechanisms, and the positioning cover plate is uniformly distributed with loading through holes corresponding to the negative pressure through holes in the substrate base. The device is simple to operate; seamless fixing between the positioning cover plate and the substrate base is realized through the positioning mechanisms; during a batch production process, the production efficiency is improved; accurate positioning of a semiconductor emitting laser device can be realized, and the processing precision is improved; scratching, peeling and other phenomena generated due to mechanical fixing of the device can be avoided, and integrity, stability and consistency of the product appearance can be ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a wire bonding fixture for ASM automatic processing equipment of semiconductor lasers. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high electro-optical conversion efficiency, stable performance, high reliability and long life, and can be widely used in communications, computers, film and television, manufacturing, aerospace, medical and other fields, and have become most promising field. [0003] The semiconductor laser packaging process includes PD (photodetector) mounting, LD (semiconductor laser) mounting, PD bonding wire, LD bonding wire, capping, testing, etc. The package base of the semiconductor emitting laser (LDTO) is usually packaged in TO56 (package size). Due to the limitation of the structure of the TO56 base, its PD mounting and PD bonding must be carried out at a certain angle of inclination, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/02H01S5/022
CPCH01S5/02H01S5/022
Inventor 陈久江
Owner CHONGQING BEIHUA TECH
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