Semiconductor device and manufacturing method thereof
A manufacturing method and semiconductor technology, which is applied in the direction of semiconductor devices, transistors, electrical components, etc., can solve the problems of narrow constant current range and low constant current, and achieve the effects of saving chip area, stable current value, and good specific withstand voltage
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[0049] This embodiment takes a semiconductor device with a forward withstand voltage of about 250V, a current of about 2E-5A / μm, and a reverse withstand voltage of about 450V as an example to describe the technical solution of the present invention in detail.
[0050] With the help of TSUPREM4 and MEDICI simulation software for example figure 2 The process simulation of the cells of the semiconductor device shown is carried out. The simulation parameters are: the thickness of the initial silicon wafer is about 250 μm, the resistivity of the N-type doped substrate 2 is 10-20Ω·cm, and the thickness of the N-type lightly doped epitaxial layer 3 is 22 μm; the depth of the two symmetrical diffused P-type well regions 4 is about 4-6 μm, and the width is about 10-12 μm, and the two diffused P-type well regions 4 are implanted with boron, and the distance between them is about 8 μm; Phosphorus is injected into the channel Adjustable ions; the first P-type heavily doped region 5 used ...
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