A fingerprint module and terminal

Abstract

The invention relates to the field of terminal manufacturing, in particular to a fingerprint module and a terminal. The fingerprint module includes a silica gel support, a first support surface of the silica gel support is provided with a first reinforcing plate, and a first flexible circuit board for electrical connection of the fingerprint module is provided on the first reinforcing plate. A fingerprint sensor module electrically connected to the first flexible circuit board is provided on a flexible circuit board, a fingerprint identification processing chip is provided on the first flexible circuit board, and a switch is provided on the second supporting surface of the silicone support member. In the embodiment of the present invention, there is no need to completely wrap the fingerprint membrane group with a complex structure of silica gel, which reduces the processing difficulty of the silica gel components, reduces the number of parts, simplifies the structure, is easy to assemble, and improves the final yield, and the switch can be directly positioned in the installation Therefore, there will be no offset, so that the pressing feel of the fingerprint module can be improved.

Description

Technical field [0001] The invention relates to the field of terminal manufacturing, in particular to a fingerprint module and a terminal. Background technique [0002] With the rapid development of smart terminals, fingerprint recognition is increasingly applied to smart terminals with its convenient operation and very strong security performance. [0003] Due to the limited space structure of smart terminals, optical fingerprint sensor modules cannot be used. Instead, smaller semiconductor fingerprint sensor modules are used. Such semiconductor sensors, whether capacitive or inductive, have similar principles. On the "plate" of thousands of semiconductor devices, the finger is attached to it and the other side of the capacitor (inductance) is formed. Because the surface of the finger is uneven, the actual distance between the convex point and the concave point to touch the plate is different , The formed capacitance / inductance value is also different, the device will collect the...

AI Technical Summary

Problems solved by technology

[0005] However, the precision of the silicone structure containing all fingerprint module components is very high, even if the deviation is 0.1mm, it will cause bad hand feeling, and after the flexible circuit board is bent 180 degrees, in order to ensure the electrical performance of the flexible circuit board and In terms of durability, it is necessary to design a support structure for the flexible circuit board, which makes the structure of the fingerprint membrane group more complex and more difficult to assemble, resulting in a low final yield. It is easy to shift, which can easily lead to bad hand feeling

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