Copper-clad plate hydroforming device

Abstract

The invention provides a copper-clad plate hydroforming device. The device comprises a pressure vessel and a control device which is arranged on the outer wall of the pressure vessel and is used for controlling a pressure vessel lamination process. A vacuum bag is arranged in the main body of the pressure vessel. Multiple copper-clad plates to be subjected to lamination molding are arranged in the vacuum bag. The bottom of the main body of the pressure vessel is provided with a heating device. The inner wall of the main body of the pressure vessel is provided with multiple temperature sensors. The heating device and the temperature sensor are electrically connected to the control device. The pressure vessel is filled with a liquid medium, forms a sealed space and applies uniform pressure for the vacuum bag. The control device controls the heating device to heat the liquid medium so that a lamination process is finished. The copper-clad plates are laminated in the liquid medium in the sealed container so that the surface of the sample to be subjected to lamination is subjected to uniform pressing. The pressed product has a small warping degree and a less plate resin solidification amount and does not easily produce white spots, cracks, layer bubbles, gaps and pits.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate preparation, in particular to a hydroforming device for copper clad laminates. Background technique [0002] Copper clad laminates (Copper Clad Laminates) are substrate materials used to manufacture printed circuit boards (PCBs). In the prior art, they are usually formed by composite hot pressing of substrates, insulating medium adhesive layers and copper foils. Since the hot pressing process is completed in air or vacuum, the molding pressure is relatively large, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product. [0003] Therefore, in view of the above-mentioned defects in the current prior art, it is necessary to conduct research to provide a solution to solve the defects in the prior art. SUMMARY OF THE INVENTION [0004] In order to solve the problems existing in the prior ...

AI Technical Summary

Problems solved by technology

Since the hot pressing process is completed in air or vacuum, the forming pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product.

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