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Self-flowing soldering method and system for laser welding

A laser welding and self-flowing technology, which is applied in the field of laser automatic welding, can solve problems such as difficulty in eating soldering iron tip, short shelf life, easy corrosion of soldering iron tip, etc., and achieve the effect of easy guarantee of processing accuracy, simple use method and good control effect

Active Publication Date: 2018-06-05
WUHAN LINGYUN PHOTOELECTRONICS SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problems in the above two welding methods: 1. The problems in soldering iron welding are: a. If the maintenance is not proper, the soldering iron tip is easy to corrode, making it difficult to eat tin; b. Rosin or weak acid flux must be used; c. Pure manual welding, low production efficiency
2. The existing problems of laser reflow soldering are: a. The storage conditions are strict and the shelf life is short. Store for 1 month; b. The method of use is relatively cumbersome. Before opening the seal, the solder paste needs to be returned to normal temperature at room temperature, which takes a long time. After returning to temperature, it needs to be stirred evenly; On the pad, because the solder paste contains a certain amount of flux, the solder joints are easy to collapse and the soldering quality deteriorates; d. There are many flux components in the solder paste, and it is easy to form air bubbles during reflow, causing the solder joints to expand and burst, causing the solder paste to splash , falling on the surface of the component, forming unnecessary solder joints

Method used

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  • Self-flowing soldering method and system for laser welding
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  • Self-flowing soldering method and system for laser welding

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments to facilitate a clear understanding of the present invention, but they do not limit the present invention.

[0033] The present invention is a self-flowing soldering method for laser welding. The solid-phase tin is converted into liquid-phase tin by means of electric heating and then stored, and kept in a liquid-phase state; after the liquid-phase tin is flowed onto the pad, Since the pad is cold liquid-phase tin into a solid-phase solder joint, the laser is used to heat the solder joint at this time, so that the tin is well infiltrated on the pad.

[0034] When transporting tin in the liquid phase, the flow of tin in the liquid phase is controlled by controlling the pressure.

[0035] A self-flowing soldering system for laser welding, comprising

[0036] Focusing head, the focusing head is used to focus the laser on the welding spot fo...

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Abstract

The invention relates to a self-flowing type soldering method and system used for laser welding and relates to the technical field of laser automatic welding. The self-flowing type soldering method used for laser welding comprises the steps that solid-phase tin is converted into liquid-phase tin to be stored through an electric heating mode, and keeps in a liquid-phase state; and after the liquid-phase tin flows to a bonding pad, welding points are heated through laser, and the tin is infiltrated on the bonding pad well. Through combination of the tin in the liquid-phase state and laser radiation, the infiltration of the tin on the cold-state bonding pad is achieved effectively.

Description

technical field [0001] The invention relates to the technical field of laser automatic welding, in particular to a self-flowing soldering method and system for laser welding. Background technique [0002] In the production and processing process, the most commonly used soldering methods are soldering iron welding and laser reflow soldering. [0003] Soldering iron welding generally uses an electric soldering iron, which heats the weldment and the solder with a lower melting point than the weldment to the melting point of the solder. When the weldment does not melt, the solder melts and infiltrates the welding surface and relies on the diffusion of the two to form a solder joint. connection of components. Its main features are the following three points: a. The melting point of the solder is lower than the melting point of the weldment; b. The weldment and the solder are heated together to the solder melting point during welding, and the solder melts but the weldment does no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/005
CPCB23K1/0056
Inventor 任振红
Owner WUHAN LINGYUN PHOTOELECTRONICS SYST
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