Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for controlling silver content in tin-silver bumps

A control method and bump technology, applied in the direction of cells, electrolytic processes, electrolytic components, etc., can solve problems such as product scrapping, product yield reduction, waste of tin-silver plating solution, etc., to achieve precise cost control, improve yield, and guarantee quality effect

Active Publication Date: 2018-01-16
NANTONG FUJITSU MICROELECTRONICS
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] If the life cycle of the tin-silver plating solution is determined only by experience, the replacement too late will lead to a decrease in the yield of the product, and in severe cases, the entire chip or even the entire batch of products will be scrapped; while the replacement is too early and the tin-silver plating solution will be wasted

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for controlling silver content in tin-silver bumps
  • Method for controlling silver content in tin-silver bumps
  • Method for controlling silver content in tin-silver bumps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0017] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0018] figure 1 It is a flowchart of a method for controlling the silver content of tin-silver bumps provided by an embodiment of the present invention.

[0019] Such as figure 1 As shown, in this embodiment, the method for controlling the silver content of tin-silver bumps provided by the prese...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for controlling the silver content of tin-silver bumps, which is characterized in that the method comprises: S30: monitoring the Sn4+ concentration of the tin-silver electroplating solution used to produce tin-silver bumps; S50: the tin-silver electroplating When the Sn4+ concentration of the solution reaches the preset limit concentration, the tin-silver electroplating solution is replaced with a newly configured tin-silver electroplating solution, and returns to step S30; wherein, the newly configured tin-silver electroplating solution contains Sn2+ and does not contain Sn4+ . The present invention monitors the Sn4+ concentration of the tin-silver electroplating solution, and replaces the tin-silver electroplating solution when the Sn4+ concentration reaches the preset limit concentration. At the same time, it is ensured that the silver content of the tin-silver bumps will not be too high, which ensures the quality of the product and improves the yield rate of the product.

Description

technical field [0001] The present application relates to the technical field of bump electroplating technology, in particular to a method for controlling the silver content of tin-silver bumps. Background technique [0002] Usually, the silver content of the tin-silver bump is determined by the silver content of the tin-silver electroplating solution and the current density during electroplating. Therefore, if the current density remains constant, the silver content of the tin-silver bump is completely proportional to the silver content in the tin-silver electroplating solution. [0003] The ideal silver content of the tin-silver bump should be between 1.5% and 2.5%. When the silver content of the tin-silver bump is close to or exceeds 3%, the surface roughness will be deteriorated, and deformed bumps or commonly known as silver needles will be formed at the same time. The tin-silver plating solution will age with time and the cumulative number of plating pieces (AmpHour)...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/60C25D21/14C25D7/00
Inventor 王自台
Owner NANTONG FUJITSU MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com