A kind of manufacturing method of aluminum base circuit board

Abstract

The invention provides a manufacturing method of an aluminum-based circuit board. The manufacturing method comprises the following steps: S1, providing an aluminum-based substrate, performing surface processing on the aluminum-base substrate to prepare an aluminum-based layer, S2, preparing a semi-cured resin sheet, S3, providing a copper foil, and stacking the copper foil on the semi-cured resin sheet so that the copper foil layer, the semi-cured resin sheet and the aluminum-based layer form a to-be-laminated aluminum-based circuit board, S4, stacking multiple to-be-laminated aluminum-based circuit boards together, placing the stacked to-be-laminated aluminum-based circuit boards into a vacuum bag, vacuumizing to 10-40Torr, and then keeping sealing; S5, placing the vacuum bag into a laminating container, and filling the laminating container with a liquid medium; S6, performing pressure and temperature adding processing on the laminating container so that the semi-cured resin sheet is cured, and S7, cooling to room temperature, and then forming the aluminum-based circuit board. The technical scheme is adopted, and preparation process of the aluminum-based circuit board and a formula of an insulating layer are improved, so heat-radiation performance of the e aluminum-based circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing an aluminum-based circuit board. Background technique [0002] Aluminum-based copper-clad laminate is one of the key components of LED lamps. In the prior art, it is usually made of aluminum base material, insulating medium adhesion layer and copper foil by composite hot pressing. Since the hot pressing process is completed in air or vacuum, the forming pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product, which in turn leads to poor heat dissipation performance. Affect the service life of LED lamps. At the same time, with the increase in the number of LEDs installed on the aluminum-based circuit board and the power of a single LED, the heat dissipation and voltage carried by the aluminum-based circuit board are also...

AI Technical Summary

Problems solved by technology

Since the hot pressing process is completed in air or vacuum, the forming pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product, which in turn leads to poor heat dissipation performance. Affect the service life of LED lamps

At the same time, with the increase in the number of LEDs installed on the aluminum-based circuit board and the power of a single LED, the heat dissipation and voltage carried by the aluminum-based circuit board are also increasing. Although the aluminum substrate and copper foil have good thermal conductivity, However, the insulating medium used in the prior art is usually a resin mixture, which cannot meet the requirements of high-power LED lamps in terms of heat dissipation and pressure resistance, thus limiting the thermal conductivity of LED aluminum substrates

Images