Antistatic flame-retardation circuit board

A circuit board, anti-static technology, applied in the direction of printed circuit, circuit heating device, printed circuit manufacturing, etc., can solve the problems of unstable sealing performance of circuit board, backward production technology, poor aging resistance, etc., and achieve the promotion of crosslinking And char formation, improve continuity and strength, good electrical insulation performance

Inactive Publication Date: 2015-12-30
中山市实翔电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the use of the circuit board, it is easy to be damaged by static electricity, moisture and other factors, which seriously affects its service life. Nowadays, the common practice is to package the circuit board. Therefore, the choice of the packaging material is indirect. Performance, currently used packaging materials include epoxy resin, polymethyl methacrylate, glass, silicone and other high-transparency materials. Epoxy resin and silicone materials are used as the main packaging materials. The internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone materials have small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, but there is

Method used

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  • Antistatic flame-retardation circuit board

Examples

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Effect test

Embodiment 1

[0037] An anti-static and flame-retardant circuit board, the heat dissipation layer 4 has a thickness of 5mm, the depth of the groove 7 in the heat dissipation layer 4 is 3mm, the diameter of the through hole on the circuit board body 1 is 1mm, and the thickness of the sealing layer 2 exceeds the maximum electronic value of the circuit board. The element height is 2 mm, and the thickness of the protective layer 3 is 0.15 mm. The protective layer is a polytetrafluoroethylene film, and the sealing layer is potting silica gel. The potting silica gel is composed of component A and component B with a weight ratio of 1:1, and component A is composed of the following raw materials in parts by weight: ethylene 40 parts of base resin, 40 parts of silica gel, 2 parts of catalyst, 4 parts of tackifier, 1 part of thickener, 7 parts of solvent, 15 parts of mica, 15 parts of aluminum hydroxide, the B component consists of the following parts by weight Composition of raw materials: 45 parts ...

Embodiment 2

[0052] An anti-static and flame-retardant circuit board, the heat dissipation layer 4 has a thickness of 8mm, the depth of the groove 7 in the heat dissipation layer 4 is 5mm, the diameter of the through hole on the circuit board body 1 is 3mm, and the thickness of the sealing layer exceeds the highest electronic component of the circuit board The height is 5mm, and the thickness of the protective layer is 0.05mm. The protective layer is a polytetrafluoroethylene film, and the sealing layer is potting silica gel. The potting silica gel is composed of component A and component B with a weight ratio of 1:1, and component A is composed of the following raw materials in parts by weight: ethylene 60 parts of base resin, 55 parts of silica gel, 4 parts of catalyst, 7 parts of tackifier, 4 parts of thickener, 15 parts of solvent, 25 parts of mica, 25 parts of aluminum hydroxide, the following parts by weight in the B component Composition of raw materials: 70 parts of vinyl resin, 35...

Embodiment 3

[0067] An anti-static and flame-retardant circuit board, the heat dissipation layer 4 has a thickness of 7mm, the depth of the groove 7 in the heat dissipation layer 4 is 4mm, the diameter of the through hole on the circuit board body 1 is 2.5mm, and the thickness of the sealing layer exceeds the maximum electronic value of the circuit board. The component height is 3mm, and the protective layer thickness is 0.1mm. The protective layer is a polytetrafluoroethylene film, and the sealing layer is potting silica gel. The potting silica gel is composed of component A and component B with a weight ratio of 1:1, and component A is composed of the following raw materials in parts by weight: ethylene 50 parts of base resin, 43 parts of silica gel, 3 parts of catalyst, 6 parts of tackifier, 3 parts of thickener, 10 parts of solvent, 21 parts of mica, 22 parts of aluminum hydroxide, the following parts by weight in the B component Composition of raw materials: 60 parts of vinyl resin, 3...

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Abstract

A disclosed antistatic flame-retardation circuit board comprises a circuit board main body, a sealing layer arranged on the circuit board main body, and a protective layer arranged on the sealing layer; the sealing layer fixedly seals the side, carrying electronic components, of the circuit board main body; and the protective layer wraps the sealing layer. The side, possessing soldering tin, of the circuit board main body is provided with a heat radiation layer, and the heat radiation layer and the circuit board main body are in connection by employing a mutually-matched concealed, overlapped or plug-in way; the circuit board main body is provided with a plurality of through holes, one side of the heat radiation layer is provided with a groove, the groove is filled with a heat-conduction liquid, and the heat-conduction liquid is capable of freely flowing in the groove and the through holes; and the connection position of the heat radiation layer and the circuit board main body is sealed by using pouring silica gel. The circuit board possesses excellent antistatic, moistureproof and electrical-isolation performances, also possesses the characteristics of good flame retardation, heat radiation and the like.

Description

technical field [0001] The invention relates to a circuit board, in particular to an antistatic and flame retardant circuit board. Background technique [0002] Circuit boards are now used in all aspects of people's lives and are an indispensable and important part of electronic products. Therefore, the performance of circuit boards is very important to electronic products. During the use of the circuit board, it is easy to be damaged by static electricity, moisture and other factors, which seriously affects its service life. Nowadays, the common practice is to package the circuit board. Therefore, the choice of the packaging material is indirect. Performance, currently used packaging materials include epoxy resin, polymethyl methacrylate, glass, silicone and other high-transparency materials. Epoxy resin and silicone materials are used as the main packaging materials. The internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, ...

Claims

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Application Information

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IPC IPC(8): C09J163/10C09J183/04C09J11/04C09J11/08H05K1/02
CPCC08K2003/2227C08L63/10C08L2201/02C08L2201/04C08L2203/206C08L2205/025C08L2205/035H05K1/0209H05K3/284C08L83/04C08L1/02C08K13/02C08K3/34C08K3/22
Inventor 张荣斌
Owner 中山市实翔电子科技有限公司
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