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Ultrathin nano radiating film material and preparation method thereof

A heat dissipation film and nanotechnology, applied in chemical instruments and methods, film/sheet adhesives, epoxy resin coatings, etc., can solve problems such as high production costs, low heat dissipation efficiency, and small application range, and achieve cost-effective Low cost, easy processing, good heat dissipation effect

Active Publication Date: 2015-12-23
昆山秉德电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a preparation method of ultra-thin nano heat dissipation film material, which is used to solve the problems of low heat dissipation efficiency, poor insulation, high production cost and small application range in the above-mentioned prior art

Method used

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  • Ultrathin nano radiating film material and preparation method thereof
  • Ultrathin nano radiating film material and preparation method thereof
  • Ultrathin nano radiating film material and preparation method thereof

Examples

Experimental program
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Embodiment 1

[0039] Embodiment 1 prepares ultra-thin nano heat dissipation film material

[0040] Step 1, preparing nano-coating material and colloidal layer material respectively: wherein

[0041] Add 50g of nano-graphite powder and 100g of nano-alumina powder into 850g of solvent-based polyurethane tree ink, and fully disperse in the disperser. The speed of the disperser is 1000 rpm, and the dispersion time is 30 minutes. The nano-coating material is obtained:

[0042] Then, 300g nano-graphite powder is added in 700g acrylic glue glue, fully disperses in disperser, and disperser rotating speed is 1000 revs / min, and dispersion time is 30 minutes, makes colloid layer material;

[0043] Step 2: Print the nano-coating material prepared in the above step 1 on the electrolytic surface of 0.03mm thick electrolytic copper foil with a gravure printing machine with more than 6 colors at a temperature of 120°C. After fully curing, the thickness of the nano-coating Colloidal layer material prepared i...

Embodiment 2

[0045] The preparation method of embodiment 2 is the same as that of embodiment 1, and the difference is that in step 2, the spraying thickness of the nano-coating is 0.005mm, the thickness of the electrolytic copper foil used is 0.3mm, and the spraying thickness of the colloidal layer is 0.05mm. The obtained ultra-thin nano heat dissipation film material 2.

Embodiment 3

[0046] The preparation method of embodiment 3 is the same as that of embodiment 1, except that in step 2, the spraying thickness of the nano-coating is 0.05mm, the thickness of the electrolytic copper foil used is 0.1mm, and the spraying thickness of the colloidal layer is 0.05mm, and the obtained Ultra-thin nano heat dissipation film material 3.

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Abstract

The invention discloses a method for preparing an ultrathin nano radiating film material. The ultrathin nano radiating film material includes a nano coating, a matrix layer and a colloid layer, the nano coating comprises 80 to 90wt% of solvent type resin ink and 10 to 20 wt% of nanoscale inorganic particulate auxiliaries, the colloid layer comprises 30 to 90wt% of crylic acid glue and 10 to 70wt% of nanoscale inorganic particulate auxiliaries, and under certain temperature the nano coating and the colloid layer are coated on an electrolytic surface or smooth surface of the matrix layer for full solidification, thereby obtaining the ultrathin nano radiating film material. The ultrathin nano radiating film material obtained by the method has an excellent radiating effect, is safe and reliable, is easy to assemble and attach, is convenient to use, and can be widely applied to parts that need heat radiation of a mobile phone, a smartphone, a computer, communication equipment and other electronic products.

Description

technical field [0001] The invention relates to a heat dissipation film material, in particular to an ultra-thin nano heat dissipation film material and a preparation method thereof. Background technique [0002] With the development of smart phones, the expansion of batteries and the diversification of functions of other electronic products, the functions of electronic products are becoming more and more entertaining, the intensity of computing components is getting higher and higher, and the size and space are getting smaller and smaller. The result is that the heat generated by the chip is increasing, and eventually the core electronic components such as the chip are often faced with the crash of electronic products due to the high local temperature, and the serious direct burnout makes it unusable. [0003] In view of this, various heat dissipation devices have emerged as the times require, in order to achieve the purpose of improving heat dissipation efficiency. From t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20C09D133/00C09D163/00C09D175/04C09D7/12C09J133/00C09J11/04C09J7/02B32B15/12
Inventor 李忠诚秦浩
Owner 昆山秉德电子科技有限公司
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