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Multiplying power calibration method of zooming objective lens of write-through photoetching machine

A lithography machine and direct-writing technology, which is applied in the field of magnification calibration of miniature objective lenses of direct-writing lithography machines, can solve the problems of difficult projection optical path magnification and large calibration errors, and achieve the effect of easy implementation and high calibration accuracy

Active Publication Date: 2015-12-16
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for calibrating the magnification of the miniature objective lens of the direct-writing lithography machine, so as to solve the problems that the magnification of the projection optical path of the direct-writing lithography machine is difficult to calibrate and the error is too large

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  • Multiplying power calibration method of zooming objective lens of write-through photoetching machine
  • Multiplying power calibration method of zooming objective lens of write-through photoetching machine
  • Multiplying power calibration method of zooming objective lens of write-through photoetching machine

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Embodiment Construction

[0035] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0036] Such as Figure 1 ~ Figure 4 As shown, a method for calibrating the magnification of the miniature objective lens of a direct-writing lithography machine comprises the following steps:

[0037] S1. Select a mask plate (Mask1) with a marking pattern (Mark1) and place it on the base installed on the precision motion platform, and keep it fixed.

[0038] S2. Make sure that the marked figure (Mark1) can be observed from the CCD field of view.

[0039] S3. The precision motion platform is moved along the X-axis and Y-axis respectively for a fixed distance to ensure that the moved mark figure (Mark1) is still within the field of view of the CCD.

[0040] S4. For the mark pattern (Mark1) in the field of view of the CCD, the moving distance is captured by machine vision, and the mark pattern (Mark1) on the substrate can be calculated through t...

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Abstract

Provided in the invention is a multiplying power calibration method of a zooming objective lens of a write-through photoetching machine. The multiplying power calibration method comprises: multiplying powers of a marking graph formed on a substrate along an X shaft direction and Y shaft direction of a precision motion platform at a CCD observation light path from a zooming objective lens to a CCD are calculated respectively; and multiplying powers of a graph generator along the X shaft direction and Y shaft direction of the precision motion platform at the light path from the zooming objective lens to the substrate and then from the substrate to the CCD through the zooming objective lens are respectively calculated. With the method, a multiplying power calibration problem of the write-through photoetching machine between the graph generator and the precision motion platform projection light path can be solved; and on the basis of the specific optical structure, an actual zooming multiplying power can be obtained according to a specific location relation of the CCD camera, the graph generator, and the precision motion platform. The method is easy to realize; and the calibration precision is high.

Description

technical field [0001] The invention relates to the technical field of exposure of a direct-writing photolithography machine, in particular to a method for calibrating the magnification of a miniature objective lens of a direct-writing photolithography machine. Background technique [0002] Photolithography is used to print a pattern of features on the surface of a substrate. Such substrates may include chips used in the fabrication of semiconductor devices, various integrated circuits, flat panel displays (eg, liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. [0003] In the direct writing exposure process, the substrate is placed on the substrate table of the precision motion platform, and the feature pattern is projected to the specified position on the substrate surface through the movement of the exposure device and the precision motion platform in the lithography equipment. In order to achi...

Claims

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Application Information

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IPC IPC(8): G02B13/00G02B7/00G01M11/02G03F7/20
Inventor 陆敏婷
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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