Thermal superconducting heat sink and manufacturing method thereof

A manufacturing method and technology of thermal superconductivity, which are applied in the manufacture/processing of superconductor devices, heat sinks, indirect heat exchangers, etc. Heat dissipation requirements and other issues, to achieve the effect of improving heat dissipation capacity and application range, convenient and flexible manufacturing, and light weight

Active Publication Date: 2018-02-02
ZHEJIANG JIAXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a thermal superconducting heat sink and its manufacturing method, which is used to solve the problem of the low efficiency of the heat sink in the air-cooled heat sink in the prior art, which cannot meet the heat dissipation requirements. problems and liquid-cooled radiators have problems such as complex system, high cost and safety risks, so as to greatly improve the fin efficiency and heat dissipation capacity of air-cooled radiators, and meet the heat dissipation requirements of high-power modules

Method used

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  • Thermal superconducting heat sink and manufacturing method thereof
  • Thermal superconducting heat sink and manufacturing method thereof
  • Thermal superconducting heat sink and manufacturing method thereof

Examples

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Embodiment 1

[0073] see Figure 1 to Figure 10 , the present invention provides a thermal superconducting heat sink, the thermal superconducting heat sink includes: several partitions and several thermal superconducting fins 1; wherein

[0074] The separators and the thermal superconducting heat dissipation fins 1 are arranged alternately, and one end surface of the separator is flush with the one end surface of the thermal superconducting heat dissipation fins 1, which jointly constitute a housing suitable for mounting power devices. The mounting surface; the partitions and the thermal superconducting fins 1 between the partitions jointly constitute the substrate of the thermal superconducting heat sink;

[0075] The thermal superconducting heat dissipation fins 1 are fixedly connected with the separator.

[0076] As an example, combine Figure 1 to Figure 3 refer to Figure 4 to Figure 6 , the thermal superconducting heat dissipation fin 1 includes two plates 11 that are composited to...

Embodiment 2

[0091] see Figure 11 , the present invention also provides a thermal superconducting heat sink, the structure of the thermal superconducting heat sink in this embodiment is roughly the same as the structure of the thermal superconducting heat sink described in Embodiment 1, the difference between the two That is: in this embodiment, the shape of the closed pipes 12 in the thermal superconducting heat dissipation fins 1 is a criss-cross network. Figure 11 Each of the quadrilaterals is the non-duct section 15 , and the structures surrounding each of the quadrilaterals and communicating with each other are the closed ducts 12 .

[0092] Other structures and features of the thermal superconducting heat sink in this embodiment are the same as those of the thermal superconducting heat sink described in Embodiment 1. For details, please refer to Embodiment 1, which will not be repeated here.

Embodiment 3

[0094] see Figure 12 , this embodiment also provides a thermal superconducting heat sink, the structure of the thermal superconducting heat sink in this embodiment is roughly the same as the structure of the thermal superconducting heat sink described in Embodiment 1, the difference between the two The point is: in this embodiment, the shape of the closed pipe 12 in the thermal superconducting heat dissipation fin 1 is a plurality of U shapes connected in series from end to end, that is, in this embodiment, the shape of the closed pipe 12 is A shape formed by connecting multiple U shapes end to end. Figure 12 The part below the middle dotted line is the combined part of the thermal superconducting heat dissipation fin 1 and the partition, that is, the part between the partitions, and the interconnected U-shaped structures in the figure are the closed pipes 12. The part located between the closed pipes 12 is the non-pipe part 15. The length direction of the dotted line is t...

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Abstract

The invention provides a thermal superconducting radiator and a manufacturing method thereof. The thermal superconducting radiator includes several partitions and several thermal superconducting fins; the partitions and the thermal superconducting fins are alternately arranged cloth, and one end surface of the partition is flush with one end surface of the thermal superconducting heat dissipation fin, which together constitute a mounting surface suitable for installing power devices; the thermal superconducting heat dissipation fin is fixed to the partition connect. Using thermal superconducting fins to replace conventional heat sinks in the prior art makes thermal superconducting heat sinks have faster heat conduction rate and higher fin efficiency, and the fin efficiency of heat sinks is not affected by the height, which improves the performance of the heat sink Heat dissipation capacity: The thermal superconducting heat sink of the present invention is convenient and flexible to manufacture, low in cost, large in heat dissipation capacity, light in weight and small in size, and has broad market prospects and huge economic value.

Description

technical field [0001] The invention relates to a radiator for heat dissipation of high-power electronic devices, in particular to a thermal superconducting radiator and a manufacturing method thereof. Background technique [0002] Due to the rapid development of power electronics technology, the integration of high-power components such as IGBTs (insulated gate bipolar transistors), diodes, and thyristors is getting higher and higher, the power density is also increasing, and the heat generated during work is also increasing. bigger. In order to ensure the normal operation of power devices, the heat must be dissipated in a timely and effective manner. Because if the heat generated by the power device cannot be dissipated in time and quickly, the temperature of the chip in the power device will rise, which will cause a decrease in performance and shorten the service life, and will lead to the failure of the power device and the burning of the chip. Therefore, solving the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367
CPCH01L23/3672H01L23/3733H01L23/473F28F2215/06F28F3/06F28F3/14F28D15/0233F28D15/0275H01L23/367F28F2013/001H10N60/01H01L23/373F28F3/02
Inventor 仝爱星斯正明
Owner ZHEJIANG JIAXI TECH CO LTD
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