Flexible chip oriented multi-thimble peeling apparatus and peeling method

Abstract

The invention discloses a flexible chip oriented multi-thimble peeling apparatus. The peeling apparatus comprises a fixed seat, a dual-vacuum cavity, a multi-thimble mechanism and a cam rotation driving mechanism, wherein the dual-vacuum cavity consists of an inner vacuum cavity and an outer vacuum cavity formed in the inner side and the outer side respectively; the inner vacuum cavity can slide up and down independently; the multi-thimble mechanism consists of an inner-ring thimble mechanism and an outer-ring thimble mechanism which are coaxially mounted and operated and controlled independently; the inner-ring thimble mechanism and the outer-ring thimble mechanism are integrally arranged at the lower part of the inner vacuum cavity in a vertical direction, and each of the inner-ring thimble mechanism and the outer-ring thimble mechanism comprises thimbles, a supporting frame and a follower; and the cam rotation driving mechanism is used for controlling time sequence of up and down actions of the inner-ring thimble mechanism and the outer-ring thimble mechanism as well as for realizing flexible switching between single-thimble and multi-thimble. The invention also discloses a corresponding peeling method. Through the peeling apparatus and the peeling method, the peeling precision and peeling efficiency can be dramatically improved, and damage on the flexible chip and a blue membrane in the peeling process can be effectively reduced; and meanwhile, the peeling apparatus has the characteristics of compact structure, convenience in operation, control and use, and the like.

Description

technical field [0001] The invention belongs to the technical field related to electronic packaging and manufacturing, and more specifically relates to a multi-thimble stripping device and stripping method for flexible chips. Background technique [0002] At present, with the increasing demand for electronic devices in the market, the rapid development of electronic device processing technology has been driven. In particular, since the advent of flexible electronics, research on the production process of flexible electronics has been increasing, and research on flexible electronics manufacturing devices has also increased. The so-called flexible electronics is an emerging electronic technology in which organic or inorganic material electronic components are fabricated on flexible and malleable plastic or thin metal substrates. , national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes (OLEDs), pr...

AI Technical Summary

Problems solved by technology

For example, CN102074458A and CN103311159A have proposed a kind of chip stripping method respectively, but they have all adopted single thimble, are only applicable to smaller and have the chip of certain thickness, then there is potential safety hazard and inapplicability

In order to overcome the defects of the above-mentioned transfer methods, some optimized technical solutions have emerged one after another. For example, CN201310716769 adopts a multi-thimble solution in structure, but this solution is only suitable for large chips, and will not be suitable for small chips. It is impossible to switch the thimble mode of chips of different sizes; in addition, this structure uses the peeling force generated by the inner and outer thimbles against the chip, and the vacuum only plays an adsorption role, and does not involve the movement control of the thimble and the vacuum chamber. and final stripping quality are deficient

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