Fabrication and package methods of high-efficiency heat-conduction semiconductor chip

Abstract

The invention discloses fabrication and package methods of a high-efficiency heat-conduction semiconductor chip. The high-efficiency heat-conduction semiconductor chip comprises a package shell, a semiconductor chip, a first reference electrode, a second reference electrode, a first soldering lug, a second soldering lug, a third soldering lug, a first graphite plate and a second graphite plate, wherein the semiconductor chip is laminated on a bearing surface of the first reference electrode, the back surface of the semiconductor chip is electrically connected with the bearing surface of the first reference electrode, the second reference electrode is electrically connected with a front surface of the semiconductor chip, the semiconductor chip, the first reference electrode, the second reference electrode, the first soldering lug, the second soldering lug and the third soldering lug are sealed in the package shell, and the semiconductor chip and the reference electrodes are respectively connected with the soldering lugs. With the high conductivity of the reference electrodes, high conductivity of a product is ensured; and meanwhile, with the high heat conductivity of the reference electrodes, heat energy can be rapidly transferred to a support plate, the possibility of fire and burst is reduced, and fire and burst are prevented due to the characteristic of the package shell.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor devices, in particular to a method for manufacturing and packaging highly efficient heat-conducting semiconductor chips. Background technique [0002] The coverage of electronic products is more and more extensive, and semiconductors are improving the development of technology in various roles. Therefore, the requirements for high-density, high-performance, high-reliability and low-cost semiconductor packaging are also more urgent. The existing heat will reduce its stable structure. However, there is also the risk of fire or explosion due to the large amount of heat that cannot be dissipated quickly. [0003] The existing pin-type semiconductor package lags behind the development goals of portable and ultra-small electronic products, and its lead inductance increases the response time of the product and reduces the protection ability of the product; when it is used with a circu...

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the problems of heat generation of semiconductor chips and plug-in forms that affect performance, reliability, and stability, thereby providing a high-efficiency heat conduction method for manufacturing and packaging semiconductor chips with high efficiency heat conduction.

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