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Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group

A fingerprint identification module and fingerprint identification technology, applied in the electronic field, can solve the problems affecting the sensitivity of fingerprint image data, the packaging technology of integrated circuit chips needs to be improved, and the need for manual polishing, etc.

Inactive Publication Date: 2015-11-11
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this structure is adopted, the surface of the molded epoxy molding compound is uneven, which affects the sensitivity of the fingerprint sensor to obtain fingerprint image data from the finger.
Further, in order to improve the surface smoothness, manual polishing is required, the steps are complicated and difficult to operate
[0003] Therefore, the current packaging technology for integrated circuit chips still needs to be improved.

Method used

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  • Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group
  • Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group
  • Fingerprint identification module group and preparation method therefor as well as electronic equipment provided with fingerprint identification module group

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: Preparation of fingerprint identification module

[0029] Set the fingerprint identification chip in the grid array packaging structure (LGA), and then place the laminated structure with the reinforcing board, flexible circuit board, LGA and ceramic cover plate in the mold from bottom to top, and then place it in the mold Inject glue (glue can be epoxy resin (bisphenol A series (BISPHENOL-A), NOVOLACEPOXY, cycloaliphatic epoxy resin (CYCLICALIPHATICEPOXY), epoxidized butadiene), polyacrylate, epoxy At least one of acrylate, urethane acrylate, unsaturated polyester, polyolefin, and polythiol), and then solidify the glue to form a support to obtain a fingerprint identification module. The structural diagram is shown in Figure 5. The bonding surface of the prepared fingerprint identification module has high flatness, smooth and smooth touch, and the response effect of the fingerprint identification chip is improved.

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Abstract

The invention discloses a fingerprint identification module group and a preparation method therefor as well as electronic equipment provided with the fingerprint identification module group. The fingerprint identification module comprises a laminated structure, a supporting piece, a fingerprint identification chip, a flexible circuit board and a reinforcement plate, wherein the supporting piece covers the laminated structure, and the laminated structure comprises a cove plate; the fingerprint identification chip is arranged under the cover plate; the flexible circuit board is arranged under the fingerprint identification chip, and is electrically connected with the fingerprint identification chip; and the reinforcement plate is arranged under the flexible circuit board. A fitting surface of the fingerprint identification module group is very flat, and has a good smooth and flat touch feel; and induction effect of the fingerprint identification chip is better.

Description

technical field [0001] The invention relates to the field of electronics, in particular, to a fingerprint identification module, a preparation method thereof, and an electronic device equipped with the fingerprint identification module. Background technique [0002] In the prior art, the fingerprint sensor is encapsulated by resin materials such as epoxy molding compound like ordinary semiconductor chips. Combined curing molding. When this structure is adopted, the surface of the molded epoxy molding compound is uneven, which affects the sensitivity of the fingerprint sensor to acquire fingerprint image data from the finger. Further, in order to improve the surface smoothness, manual polishing is required, and the steps are complicated and difficult to operate. [0003] Therefore, the current packaging technology for integrated circuit chips still needs to be improved. Contents of the invention [0004] The present invention aims to solve one of the technical problems i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/12
Inventor 雷俊
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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