Packaging substrate and fabrication method thereof

Abstract

A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density.

Description

technical field [0001] The invention relates to a packaging substrate and a manufacturing method thereof, in particular to a packaging substrate with electronic components and a manufacturing method thereof. Background technique [0002] like figure 1 As shown, the package substrate of the existing molded interconnection system (molded interconnection system, referred to as MIS) connects a plurality of first conductive parts 11 to a plurality of metal pillars 12, and connects the plurality of metal pillars 12 to a plurality of The second conductive part 13 is used to cover the first conductive part 11 and the metal pillar 12 with the package body 14; however, when the aspect ratio of the metal pillar 12 is too large, the effect of electroplating the metal pillar 12 is not good, but now The specification of the capacitor height is generally above 110 microns (μm). Therefore, if the capacitor is to be embedded in the aforementioned packaging substrate, the height of the metal...

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Problems solved by technology

However, the more manufacturing steps, the more accumulated manufacturing tolerances, in order to maintain the original area of ​​the second conductive portion 13, the range of the first sub-metal pillar 121 must be larger than the range of the second sub-metal pillar 122, so as to The first sub-metal pillar 121 provides sufficient alignment margin for the second sub-metal pillar 122; similarly, in order for the first conductive portion 11 to provide sufficient alignment margin for the first sub-metal pillar 121, the The range of the first conductive portion 11 must also be larger than the range of the first sub-metal pillar 121, which greatly increases the area of ​​the first conductive portion 11, thereby limiting the available wiring space.

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