FPD/TP positive photoresist used for flexible substrate

A positive photoresist and flexible technology, applied in the field of photoresist, can solve the problems of poor adaptability, poor chemical resistance, low resolution, etc., and achieve the effect of simple production, high resolution and wide application range

Inactive Publication Date: 2015-10-07
SUZHOU RUIHONG ELECTRONIC CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because acrylic resin photoresist has poor chemical resistance and relatively low resolution (about 60u), it is not suitable for FPD / TP with slightly higher precision.

Method used

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  • FPD/TP positive photoresist used for flexible substrate
  • FPD/TP positive photoresist used for flexible substrate
  • FPD/TP positive photoresist used for flexible substrate

Examples

Experimental program
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Embodiment Construction

[0028] In the photoresist of the present invention, diazonaphthoquinone sulfonate is used as a sensitizer, and the mass percentage content is preferably 5-30%. When the content of the diazonaphthoquinone sulfonate is lower than 5% or higher than 30% by mass, the photosensitive performance of the photoresist is not ideal, and underexposure or overexposure is likely to occur, resulting in unsatisfactory graphics after development.

[0029] Among them, linear phenolic resin, thermoplastic polymer formed by polycondensation of cresol and formaldehyde under the action of acid catalyst, molecular weight: Mn: 1000-1100; Mw: 5000-6000. Softening point: 140~160. The molecular weight is too high or too low, will affect the alkali dissolution rate of the photoresist in dilute alkali after film formation

[0030] Long-chain alkylphenol, a mixture of alkylphenols with carbon atoms between 10`20 in the molecule. Due to the long carbon chain in the molecule, it plays a certain flexibility in th...

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Abstract

The invention provides a FPD / TP positive photoresist applicable to a flexible substrate. The photoresist is composed of the following components by mass: 5 to 30% of diazonaphthoquinone sulphonate, 30 to 90% of phenolic novolac resin, 2 to 30% of long-chain alkylphenol, 0.01 to 10% of a silicone coupling agent, 0.01 to 10% of epoxy soybean butyl oleate, 5 to 50% of a nanometer reinforcing agent (nanometer carbon black), 5 to 30% of melamine resin and 50 to 90% of propylene glycol monomethyl ether acetate. The positive phenolic photoresist has good adhesion and all technical performances (like coating property, resolution and sensitivity) of a traditional positive phenolic photoresist, can be well applied in production of FPD / TP with high requirement for resolution (about 5 [mu]m), and has good application prospects.

Description

Technical field [0001] The invention relates to a photoresist, in particular to a positive photoresist for FPD / TP applied to a flexible substrate. Background technique [0002] Photoresist, also known as photoresist, is a light-sensitive mixed liquid composed of three main components: photosensitive resin, sensitizer (see spectral sensitizing dye) and solvent. After the photosensitive resin is exposed to light, a photochemical reaction can occur quickly in the exposed area, which makes the physical properties of this material, especially the solubility and affinity, change significantly. After proper solvent treatment, the soluble part is dissolved to obtain the desired image. [0003] The technology of photoresist is complex and there are many varieties. According to its chemical reaction mechanism and development principle, it can be divided into two types: negative glue and positive glue. It is a negative glue that forms an insoluble substance after light; on the contrary, it...

Claims

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Application Information

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IPC IPC(8): G03F7/039
Inventor 陆水忠
Owner SUZHOU RUIHONG ELECTRONIC CHEM CO LTD
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