Underfill composition and packaging process using the same

An underfill and encapsulation technology used in modified epoxy resin adhesives, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as narrow reflow operation window, achieve accurate flow and ensure production volume , to avoid the effect of overflow

Active Publication Date: 2015-09-23
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this no-flow underfill technology has a very narrow reflow operating window to balance the soldering and underfill curing processes

Method used

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  • Underfill composition and packaging process using the same
  • Underfill composition and packaging process using the same
  • Underfill composition and packaging process using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3 and comparative example 1

[0158] Underfill Compositions 1-3 and Comparative Example 1 were formulated according to Table 1.

[0159] Each composition was formulated conventionally by mixing the individual components in the respective amounts listed in Table 1 with stirring in a suitable container.

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Abstract

Provided is a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.

Description

[0001] The present invention relates to an underfill composition, in particular, to a one-component liquid underfill composition, and to an encapsulation process using the underfill composition. Background technique [0002] With the development of handheld electronic devices such as smartphones and tablet computers, these devices become thinner and have more and more functions, which makes the design of printed circuit boards (PCBs) more and more complicated. Thousands of components including packages such as CSP (Chip Scale Package), BGA (Ball Grid Array Package), LGA (Land Grid Array Package) and POP (Package on Package) and components such as resistors and capacitors are used integrated on a small PCB. Generally, a CSP / BGA package is surrounded by many components. Some of these components are very sensitive and contamination with underfill can cause quality issues. [0003] Underfill compositions (also known as underfills) are widely used on integrated circuit boards in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L33/08C08L33/10C08G59/40H01L21/56
CPCC08L33/10C08L33/08H01L21/563H01L2224/92125H01L2224/32225C08L63/00H01L2224/73204C08G59/40H01L2224/16225H01L23/293H01L2924/19105C08G59/4007C08K3/04H01L2924/00012H01L2924/00C09J163/10
Inventor 胡晓龙D·怀亚特J·英格兰P·J·格利森何任飞
Owner HENKEL KGAA
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