Film with high mechanical tensile property

Abstract

The invention discloses a high-reliability double-sided screen protector. The radiating double-sided screen protector is fitted between a radiating part and a heating part, a first heat conduction adhesive layer, a graphitic layer and a second heat conduction adhesive layer are sequentially arranged between a light peel-off type PET (polyester) film and a heavy peel-off type PET film, the graphitic layer is obtained according to the following process method comprising the step of coating a layer of graphite modifier on both the upper surface and the lower surface of a polyimide film to acquire the processed polyimide film, the graphite modifier comprises the following components in parts by weight: 20-25 parts of benzophenonetetracarboxylicdianhydride, 12-18 parts of pyromelliticdianhydride,20-28 parts of diaminodiphenylmethane, 30-35 parts of dimethylformamide, 1.5-2.5 parts of ethylene glycol, and 2-3 parts of polydimethylsiloxane. The heat conduction performances in both the vertical direction and the horizontal direction are improved, the local overheating of an adhesive tape is avoided, the stability and the reliability of the radiating performance of a product are improved, and the cost of the product is greatly lowered.

Description

technical field [0001] The invention relates to a film with high mechanical tensile properties, belonging to the technical field of face film. Background technique [0002] Laptops, mobile phones, tablet computers, etc. are increasingly becoming ultra-thin and light. This structure significantly increases the internal power density of electronic equipment, and the heat generated during operation is difficult to discharge and easily accumulates quickly to form high temperatures. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer heat to ensure the normal operation of electronic equipment. [0003] On the other hand, polyimide films are...

AI Technical Summary

Problems solved by technology

[0003] On the other hand, polyimide films are mostly used in flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the product quality and performance of polyimide films. The good and the bad are mixed, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation instability, poor reliability performance, and is not conducive to product quality control. product competitiveness