Fingerprint identification chip packaging structure and packaging method
A fingerprint identification and packaging method technology, which is applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve the requirements of high sensitivity of sensor chips, manufacturing and application limitations of fingerprint identification devices, and increased manufacturing costs, etc. problems, achieving the effects of simple packaging method, improved sensitivity, and reduced manufacturing cost
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[0039] As mentioned in the background art, the fingerprint identification device manufactured by the prior art has higher requirements on the sensitivity of the sensor chip, which limits the manufacture and application of the fingerprint identification device and increases the manufacturing cost.
[0040] After research, please continue to refer to figure 1 , the surface of the fingerprint identification chip 101 is covered with a glass substrate 102, the glass substrate 102 is used to protect the fingerprint identification chip 101, and the user's finger 103 is directly in contact with the glass substrate 102, therefore, in order to ensure that the glass substrate 102 has For sufficient protection capability, the thickness of the glass substrate 102 is relatively thick. However, since the glass substrate 102 is relatively thick, the fingerprint recognition chip 101 is required to have high sensitivity, so as to ensure that the user's fingerprint can be accurately extracted. ...
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