Fingerprint identification chip packaging structure and packaging method

A fingerprint identification and packaging method technology, which is applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve the requirements of high sensitivity of sensor chips, manufacturing and application limitations of fingerprint identification devices, and increased manufacturing costs, etc. problems, achieving the effects of simple packaging method, improved sensitivity, and reduced manufacturing cost

Inactive Publication Date: 2015-08-19
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the fingerprint identification device manufactured by the prior art has higher requirements on the sensitivity of the sensor chip, which limits the manufacture and application of the fingerprint identification device and increases the manufacturing cost.

Method used

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  • Fingerprint identification chip packaging structure and packaging method
  • Fingerprint identification chip packaging structure and packaging method
  • Fingerprint identification chip packaging structure and packaging method

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Embodiment Construction

[0039] As mentioned in the background art, the fingerprint identification device manufactured by the prior art has higher requirements on the sensitivity of the sensor chip, which limits the manufacture and application of the fingerprint identification device and increases the manufacturing cost.

[0040] After research, please continue to refer to figure 1 , the surface of the fingerprint identification chip 101 is covered with a glass substrate 102, the glass substrate 102 is used to protect the fingerprint identification chip 101, and the user's finger 103 is directly in contact with the glass substrate 102, therefore, in order to ensure that the glass substrate 102 has For sufficient protection capability, the thickness of the glass substrate 102 is relatively thick. However, since the glass substrate 102 is relatively thick, the fingerprint recognition chip 101 is required to have high sensitivity, so as to ensure that the user's fingerprint can be accurately extracted. ...

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Abstract

The invention provides a fingerprint identification chip packaging structure and a packaging method. The packaging method comprises the steps that a substrate is provided; an induction chip is coupled at the surface of the substrate, the induction chip is provided with a first surface and a second surface which is opposite to the first surface, the first surface of the induction chip comprises induction areas, and the second surface of the induction chip is arranged at the surface of the substrate; and a plastic packaging layer is formed at the surfaces of the substrate and the partial induction chip, and the plastic packaging layer is exposed out of the induction areas. Sensitivity of the packaging structure of a fingerprint identification chip is enhanced, the packaging technology is simplified and manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a packaging structure and packaging method of a fingerprint recognition chip. Background technique [0002] With the progress of modern society, the importance of personal identification and personal information security has gradually attracted people's attention. Due to the uniqueness and invariance of human fingerprints, fingerprint identification technology has the characteristics of good security, high reliability, and simple and convenient use, making fingerprint identification technology widely used in various fields to protect personal information security. With the continuous development of science and technology, the information security of various electronic products has always been one of the key points of technological development. Especially for mobile terminals, such as mobile phones, notebook computers, tablet computers, digital cameras, etc., ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/31H01L23/29G06K9/00
CPCH01L21/56H01L23/293H01L23/3171G06V40/12H01L2224/04042H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2224/92247H01L2924/1815H01L23/3121G06V40/1306H01L2924/00014H01L2924/00012H01L2224/32245H01L2224/48247H01L2924/00H01L23/29H01L23/31H01L23/291
Inventor 王之奇杨莹喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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