An infrared led bracket

A technology of LED brackets and infrared rays, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as the inability to realize the controllability of infrared emission angles, and achieve the effects of increasing stability, improving electrical conductivity, and increasing heat dissipation area

Active Publication Date: 2017-08-15
深圳莱特光电股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current infrared LED mainly adopts the SMD infrared light-emitting diode structure, which cannot realize the controllability of the infrared emission angle.

Method used

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  • An infrared led bracket
  • An infrared led bracket
  • An infrared led bracket

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Such as Figure 1~4 As shown, the novel infrared LED bracket disclosed in this embodiment includes a PCB board 1, on which a first metal bracket 2 and a second metal bracket 3, a first metal bracket 2 and a second metal bracket are arranged An intermediate insulating layer 10 is provided between 3. The first metal bracket 2 is provided with an inverted tapered through hole to form a reflector 4, and an infrared LED chip 5 is fixed on the PCB at the bottom of the reflector. The infrared LED chip passes through the first gold wire 6 and The second gold wire 7 is connected to the first metal bracket 2 and the second metal bracket 3. The two ends of the PCB board 1 are fixedly provided with a first electrode 8 and a second electrode 9 respectively. The first electrode 8 and the second electrode 9 respectively extend to the bottom of the first metal bracket 2 and the second metal bracket 3, and respectively The first metal bracket 2 and the bottom of the second metal bracke...

Embodiment 2

[0036] This embodiment provides a type of infrared LED bracket, such as figure 1 It includes a PCB board 1 on which a first metal bracket 2 and a second metal bracket 3 are arranged, and an intermediate insulating layer 10 is arranged between the first metal bracket 2 and the second metal bracket 3. Preferably, the first metal bracket and the second metal bracket are copper brackets.

[0037] The first metal bracket 2 and the second metal bracket 3 are adhered to the PCB board by conductive adhesive.

[0038] Preferably, in this embodiment, a conductive adhesive can be specially selected, and its raw materials are composed of 65 parts of acrylic glue, 0.06 parts of diphenylmethane diisocyanate, 8 parts of copper powder, 1 part of butyl acetate, and 2 parts of diphenylmethane diisocyanate by weight. Benzoylmethane, 0.7 parts of acetophenone, 0.2 parts of potassium hydroxide, 0.09 parts of zinc sulfate, 6 parts of glycerol. Said acrylic glue is preferably oily acrylic glue, which ca...

Embodiment 3

[0040] This embodiment provides a type infrared LED bracket, the structure of which is the same as the first embodiment. The first metal bracket and the second metal bracket are preferably made of 304 stainless steel.

[0041] Preferably, in this embodiment, a conductive adhesive can be specially selected, and its raw materials are composed of 65 parts of acrylic glue, 0.06 parts of diphenylmethane diisocyanate, 8 parts of copper powder, 1 part of butyl acetate, and 2 parts of diphenylmethane diisocyanate by weight. Benzoylmethane, 0.7 parts of acetophenone, 0.2 parts of potassium hydroxide, 0.09 parts of zinc sulfate, 6 parts of glycerol. Said acrylic glue is preferably oily acrylic glue, which can be realized by commercially available products, particularly preferably the viscosity is 4000-12000 CPS, and the glue is coated to a dry glue thickness of 0.025mm. Adhesion: greater than 2000g / 25mm. Coat the conductive adhesive on the adhesion part, the thickness is 0.2mm, and the st...

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Abstract

The invention discloses a novel infrared LED support, and the support comprises a PCB which is provided with two metal supports. The first metal support is provided with a through hole shaped like an inverted cone, thereby forming a reflecting cup. A part, at the bottom of the reflecting cup, of the PCB is fixedly provided with an infrared LED chip. The infrared LED chip is connected to the two metal supports through two gold lines. Two ends of the PCB are respectively provided with one electrode, and the two electrodes respectively extend and contact with the bottoms of the two supports. According to the invention, the PCB is provided with the two metal supports, wherein one metal support is provided with a reflecting cup. The infrared LED chip is fixed on the PCB at the bottom of the reflecting cup, and infrared light is transmitted outwards through the reflecting cup. The transmitting angle of infrared light can be controlled through the changing of the depth and size of the reflecting cup, thereby improving the precision of the infrared transmitting angle of the infrared LED and reflectivity of the infrared LED, reducing the manufacturing cost of products, and improving the yield.

Description

Technical field [0001] The invention relates to an infrared LED, in particular to an infrared LED bracket. Background technique [0002] With the development of technology and the improvement of material living standards, people’s demand for improving the quality of life is becoming stronger and stronger, especially for the improvement of the home environment. The smart home (digital home) industry has become very hot, especially in recent years. With the intelligentization of home appliances and home improvement products, the realization technology of smart home is also more advanced, and the user experience is greatly improved. However, most home appliances still use the traditional infrared remote control. Infrared remote control mainly uses infrared LED for infrared emission. Infrared LED is a kind of diode that can emit infrared, which is usually used in remote control and other occasions. The emission intensity of infrared LED varies with the emission direction. When the d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/62H01L33/64H01L33/38
CPCH01L33/38H01L33/483H01L33/60H01L33/642H01L33/647
Inventor 冯海涛
Owner 深圳莱特光电股份有限公司
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