Wafer scanning and cleaning swing arm device

Abstract

The invention relates to a wafer scanning and cleaning swing arm device. The wafer scanning and cleaning swing arm device comprises a swing arm part, a nozzle, a lifting part, a swing part and a shell, wherein the swing arm part is provided with a swing arm shaft, the nozzle is mounted on the swing arm part and can rotate around the swing arm part, the lifting part is used for driving the swing arm part to move along the vertical direction, the swing part is used for driving the swing arm shaft of the swing arm part to rotate, and the shell is used for mounting the swing arm part, the lifting part and the swing part. The nozzle is mounted on the swing arm part and can rotate round the swing arm part, so that spraying angle of the nozzle to wafers can be conveniently adjusted; by the aid of the swing part, the swing arm shaft of the swing arm part is driven to rotate, and scanning swing of the swing arm part is realized. By the lifting part, the swing arm part is driven to move along the vertical direction, so that the problems that wafer cleaning effect is poor and cleaning dead corners possibly exist due to the fact that a conventional swing arm part only swing to one direction for scanning are solved.

Description

technical field [0001] The invention belongs to the technical field of wafer cleaning in the process of semiconductor wafer processing, and in particular relates to a scanning cleaning swing arm device for cleaning the surface of the wafer. Background technique [0002] During the semiconductor wafer manufacturing process, the wafer needs to go through multiple cleaning steps. Due to the continuous reduction of critical dimensions of device process technology and the introduction of new materials, surface cleaning treatment in front end of line (FEOL) is more important. The shrinking of critical dimensions narrows the cleaning process window, making it increasingly difficult to meet wafer cleaning efficiency while minimizing wafer surface damage and structural damage. [0003] Wafer wet cleaning is divided into two methods: tank cleaning and single wafer cleaning. Single wafer cleaning can reduce the risk of cross-contamination during cleaning and improve yield. By using ...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a wafer scanning and cleaning swing arm device. The technical problem to be solved is that the swing arm device of the traditional wafer cleaning device only has the scanning swing function, and the cleaning effect is poor when cleaning the wafer, and there may be cleaning dead angles.

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