Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Non-contact ground stress testing device and method based on drilling microscopic digital camera

A test device, non-contact technology, applied in the direction of measuring devices, measuring force, instruments, etc., can solve the problems of electromagnetic interference, harsh environmental requirements, probes can not be reused, etc., to achieve strong anti-interference ability, strong adaptability, The effect of low cost

Active Publication Date: 2017-04-05
CHINA UNIV OF MINING & TECH
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a non-contact ground stress testing device and method based on drilling microscopic digital photography, which solves the problem of complex operation, harsh environmental requirements, low precision, and susceptibility to temperature, Rock viscosity, electromagnetic interference, probes cannot be reused, and high cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Non-contact ground stress testing device and method based on drilling microscopic digital camera
  • Non-contact ground stress testing device and method based on drilling microscopic digital camera
  • Non-contact ground stress testing device and method based on drilling microscopic digital camera

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Example 1: The non-contact ground stress test device 1 is located in the test device installation hole 2, the test device installation hole 2 is located in the initial large diameter hole 3, the test device installation hole 2 and the initial large diameter hole 3 In between is the lifted core 4, and the main engine 5 is located outside the initial large-diameter borehole 3;

[0055] The non-contact ground stress testing device 1 includes: an electronic microscope camera 17, a lighting lamp 15, a signal processing and control module 111, a signal transmission module 112, a gyroscope 113, a signal acquisition module 18, a mobile power supply 110 and a device housing 115; At both ends of the device housing 115 are respectively connected the guide piston 11 and the device connector and the rear piston 114; the device housing 115 is provided with an electronic microscope camera 17, electronic microscope camera 17, gyroscope 113, signal transmission module 112 Connected to the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a non-contact ground stress testing device and method based on drilling microscopy digital photography and belongs to ground stress measuring device and method of geotechnical engineering. The device comprises an electronic microscopy camera, a signal processing and control module, a signal transmission module, a gyroscope, a signal collecting module, a portable power source and a device shell. The method includes: fixing the testing device in a device mounting hole, using the electronic microscopy camera to collect the hole wall digital images of the hole during a whole stress relieving process, selecting the representative images before and after the stress relieving, acquiring sub-pixel images through image interpolation, optimizing sub-pixel image analyzing areas and points, setting analyzing traces, calculating to obtain strain values, and calculating the ground stress values and the azimuth angles thereof by the hole partial wall surface stress relieving method theory. The non-contact ground stress testing device and method has the advantages that simple operation and high adaptability are achieved, testing precision can reach one micro strain, strain measuring mark points and analyzing traces are optimized, influence of temperature, rock viscosity and electromagnetic interference is avoided, a probe can be reused, and low cost is achieved.

Description

Technical field [0001] The invention relates to a geostress measurement device and method for geotechnical engineering, in particular to a non-contact type geostress test device and method based on drilling microscopic digital photography. Background technique [0002] In-situ stress is the original stress that exists in the stratum and is not disturbed by the engineering. It is the root of engineering disasters such as engineering deformation and destruction under rock and soil, rock burst, coal and gas outburst. In-situ stress measurement is a necessary prerequisite for analyzing the stability of surrounding rock and realizing scientific decision-making on engineering layout, excavation and support design under rock and soil. According to different physical parameters measured, in-situ stress testing can be divided into hydraulic fracturing method, acoustic emission method, surrounding rock failure track analysis method and deformation measurement method. Among them, the hollow...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/00
Inventor 孟波靖洪文李元海陈坤福许国安
Owner CHINA UNIV OF MINING & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products