Chip electronic component and manufacturing method thereof

Abstract

The present invention provides a chip electronic component and a manufacturing method thereof, more specifically a chip electronic component having an inner coil structure capable of preventing short circuit between the coil portions by increasing the thickness of the coil relative to the width of the coil and implementing a high aspect ratio (AR), and a manufacturing method thereof.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0158080 filed in the Korean Intellectual Property Office on December 18, 2013, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip electronic component and a manufacturing method thereof. Background technique [0003] Inductors, one of chip electronic components, are representative passive components that form electronic circuits together with resistors and capacitors to remove noise. Such an inductor is combined with a capacitor using electromagnetic properties to constitute a resonance circuit, a filter circuit, etc. that amplify a signal of a specific frequency band. [0004] Recently, since miniaturization and slimming of information technology (IT) devices such as various communication devices, display devices, etc. have been accelerated, miniaturization of various elements such as inductors, capacitors, transisto...

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Problems solved by technology

However, in this case, since the plating resist needs to have a predetermined width or more in order to maintain the shape of the plating resist, the spacing between the coil parts increases.

[0011] In addition, when the electroplating method is performed according to the prior art, due to the isotropic growth phenomenon in which the coil grows in its width direction and in its thickness direction, a short circuit occurs between coil parts and a high aspect ratio (AR) is achieved. There are restrictions

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