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Method for preparing heavy metal adsorption material from waste circuit board non-metal powder

A technology for waste circuit boards and adsorption materials, which is applied in the field of preparing heavy metal adsorption materials from non-metallic powders of waste circuit boards, which can solve the problems of low utilization value, few utilization methods, waste of resources, etc.

Inactive Publication Date: 2015-06-17
FUJIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are not many ways to utilize the non-metallic powder that accounts for 70% of the weight of the circuit board. The size of the non-metallic powder is generally 3-5 μm, and the main components are glass fiber, thermosetting epoxy resin and various additives. At present, it is generally directly landfilled. Or simply used as a filler for other materials, the use value is low, resulting in a great waste of resources

Method used

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  • Method for preparing heavy metal adsorption material from waste circuit board non-metal powder
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  • Method for preparing heavy metal adsorption material from waste circuit board non-metal powder

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Such as figure 2 As shown, first place 10 grams of micron-sized waste circuit board non-metallic powder and 200 ml of water in a high-temperature and high-pressure reactor with a volume of 500 ml, then add 3 grams of NaOH to the reactor, seal the reactor, and start heating. The internal pressure of the reactor was controlled at 5 MPa by manual pressurization. The temperature was raised to 200°C at a rate of 10°C / min by temperature programming control, the heating was stopped, and the temperature began to drop. When the temperature dropped to 90°C, the temperature was raised to 200°C at a rate of 10°C / min. Heat up and down 3 times according to the above procedure. After the reaction, the reactor was cooled to room temperature. The cooled product was transferred to a centrifuge tube, centrifugally filtered, and the solid phase was washed three times with deionized water, each time with 10 ml of deionized water. Finally, the solid-phase product was vacuum-dried for 24 ...

Embodiment 2

[0022] Such as figure 2 As shown, first place 10 grams of micron-sized waste circuit board non-metallic powder and 200 milliliters of water in a high-temperature and high-pressure reactor with a volume of 500 milliliters, then add 0.5 grams of NaOH to the reactor, seal the reactor, and start heating. The internal pressure of the reactor was controlled at 5 MPa by manual pressurization. The temperature was raised to 200°C at a rate of 10°C / min by temperature programming control, the heating was stopped, and the temperature began to drop. When the temperature dropped to 90°C, the temperature was raised to 200°C at a rate of 10°C / min. Heat up and down 3 times according to the above procedure. After the reaction, the reactor was cooled to room temperature. The cooled product was transferred to a centrifuge tube, centrifugally filtered, and the solid phase was washed three times with deionized water, each time with 10 ml of deionized water. Finally, the solid-phase product was ...

Embodiment 3

[0024] Such as figure 2 As shown, first place 10 grams of micron-sized waste circuit board non-metallic powder and 200 ml of water in a high-temperature and high-pressure reactor with a volume of 500 ml, then add 1 gram of NaOH to the reactor, seal the reactor, and start heating. The internal pressure of the reactor was controlled at 5 MPa by manual pressurization. The temperature was raised to 200°C at a rate of 10°C / min by temperature programming control, the heating was stopped, and the temperature began to drop. When the temperature dropped to 90°C, the temperature was raised to 200°C at a rate of 10°C / min. Heat up and down 3 times according to the above procedure. After the reaction, the reactor was cooled to room temperature. The cooled product was transferred to a centrifuge tube, centrifugally filtered, and the solid phase was washed three times with deionized water, each time with 10 ml of deionized water. Finally, the solid-phase product was vacuum-dried for 24 h...

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Abstract

The invention discloses a method for preparing a heavy metal adsorption material from a waste circuit board non-metal powder. The method includes the following steps: a, material placing; b, temperature rising-dropping reaction; and c, material obtaining. With combination of composition structural characteristics of the waste circuit board non-metal powder, a subcritical water alternative temperature rising and dropping-NaOH activation technique is adopted, and the waste circuit board non-metal powder is activated to prepare the high-efficiency adsorption material having high additional value and applied in heavy metal wastewater treatment, and the waste circuit board non-metal powder is allowed to obtain high additional value utilization.

Description

technical field [0001] The invention relates to a method for converting solid waste into harmless or useful substances, in particular to a method for preparing heavy metal adsorption materials by using non-metallic powder of waste circuit boards. Background technique [0002] In recent years, e-waste has become an issue of greatest concern to governments, the electronics industry, and the public. With the acceleration of the replacement of electronic products and the shortening of the life cycle of electronic products, more and more discarded electronic products pose a huge threat to environmental safety. As the most basic component of electronic products, the safe and efficient disposal or resource utilization of waste circuit boards has become the focus of countries all over the world. At present, the recycling of waste circuit boards mainly adopts mechanical crushing to dissociate the metal in the circuit boards, and then separates metal materials and non-metal materials...

Claims

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Application Information

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IPC IPC(8): B01J20/00B01J20/30C02F1/28C02F1/62
Inventor 修福荣齐莹莹
Owner FUJIAN UNIV OF TECH
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