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Encapsulation equipment and encapsulation method

A technology for packaging equipment and packaging methods, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problem of low utilization rate of packaging efficiency equipment, shorten the average production cycle, efficiently utilize, and improve packaging efficiency. Effect

Active Publication Date: 2016-10-26
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is how to solve the problems of low packaging efficiency and equipment utilization in the existing OLED display packaging process

Method used

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  • Encapsulation equipment and encapsulation method
  • Encapsulation equipment and encapsulation method
  • Encapsulation equipment and encapsulation method

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Embodiment Construction

[0030] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] An embodiment of the present invention provides a packaging device, including:

[0032] The upper abutment and the lower abutment arranged oppositely, and the support between the upper abutment and the lower abutment;

[0033] A laser emitting device, the laser emitting device includes a laser source for generating laser light and an emitting head connected to the laser source, the emitting head is arranged on the support, and the laser light generated by the laser source passes through the emitting head The head forms two laser beams in opposite directions, one of which is directed to the upper base for packaging the device to be packaged on the upper base, and th...

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Abstract

The present invention provides a packaging device and a packaging method. The packaging device includes: an upper base and a lower base that are arranged oppositely, a bracket located between the upper base and the lower base; a laser emitting device, the The laser emitting device includes a laser source for generating laser light and an emitting head connected to the laser source, the emitting head is arranged on the support, and the laser light generated by the laser source passes through the emitting head to form a Two laser beams, one of which is directed at the upper base for packaging the device to be packaged on the upper base, and the other laser beam is directed at the lower base for packaging The device to be packaged is packaged on the lower submount. The packaging equipment provided by the invention can not only improve packaging efficiency, shorten the average production cycle of products, but also realize efficient utilization of laser equipment.

Description

technical field [0001] The present invention relates to the display field, in particular to a packaging device and a packaging method. Background technique [0002] Organic light-emitting diode (OLED) displays have the characteristics of self-luminescence, simple structure, ultra-thin, fast response, wide viewing angle, and low power consumption. At present, one of the packaging methods used in organic light emitting diode displays is glass glue (frit) packaging. The specific method is to place the combined two substrates (encapsulation cover and TFT substrate) on the base, and then pass through the substrate. The laser emitting device above the table emits laser light downwards to the packaging area of ​​the two substrates, and the packaging cover plate and the TFT substrate are bonded together by glass glue through laser sintering. The emitting device can only be packaged on the lower substrate, which causes the problems of low packaging efficiency and equipment utilizati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56
CPCH10K50/84H10K71/00
Inventor 赵鑫崔富毅纪鹏张亮
Owner BOE TECH GRP CO LTD
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