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Method for adhesively connecting target and backboard

A connection method and target technology, which are applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems of difficult target welding operation, increased leveling process, large thermal stress, etc., so as to avoid thermal deformation and meet the Connection requirements, effect of low connection temperature

Inactive Publication Date: 2015-06-10
GRIKIN ADVANCED MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the welding operation of the target at high temperature is difficult; the target with a large difference in thermal expansion coefficient from the back plate has a large thermal stress after welding, and the post-weld deformation is large; the heat-distorted target needs to increase the leveling process after welding

Method used

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  • Method for adhesively connecting target and backboard
  • Method for adhesively connecting target and backboard
  • Method for adhesively connecting target and backboard

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Embodiment Construction

[0032] The present invention provides a method for adhesively connecting a target material and a backplane, and the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0033] Such as figure 1 As shown, step S101 is executed to provide a target material and a back plate;

[0034] Execute step S102 to process the bonding surface of the target material and the back plate;

[0035] The metal target can be sandblasted or machined on the bonding surface, and the non-metallic target can be sandblasted as required.

[0036] Execute step S103, apply adhesive glue on the bonding surface of the target material and the back plate, so that the bonding surface is evenly covered with a thin layer of adhesive glue;

[0037] Execute step S104, pad metal wire or metal mesh at the bonding place if necessary, pressurize and fix the target material and the back plate, and cure the adhesive glue to complete the bonding operat...

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Abstract

The invention belongs to the technical field of manufacturing of targets, and particularly relates to a method for adhesively connecting a target and a backboard. The method comprises the following steps: providing the target and the backboard; processing an adhesion surface of the target and the backboard; evenly coating and adhering required organic glue on the adhesion surface of the target and the backboard; adhering the target and the backboard, and using a normal-temperature solidifying or low-temperature solidifying mode to guarantee reliable adhesion. The organic glue is used in adhesion to achieve the reliable connection of the target at the normal temperature or low temperature, the excellent thermal conductivity and electric conductivity and the enough connection strength are guaranteed in the sputtering process of the target, meanwhile, the connection temperature is reduced, so that the problems of target fragmentation, deformation and the like possibly caused by high-temperature heating are avoided, the requirement of connection of the special target at the normal temperature is met, meanwhile, the operation difficulty is lowered, and the yield is improved.

Description

technical field [0001] The invention belongs to the technical field of target material manufacturing, and in particular relates to an adhesive connection method between a target material and a back plate. Background technique [0002] Sputtering coating is a common process in the manufacture of chips and devices such as integrated circuits, flat-panel displays, and solar cells. The sputtering target assembly is usually composed of a target that meets the sputtering requirements and a backplane. The back plate has a certain strength, provides support when the target assembly is installed on the sputtering machine, and has good thermal and electrical conductivity. [0003] At present, the main connection methods between the target and the backplane are mechanical connection and welding. Among them, it is difficult to be completely dense on the butt surface that mechanically connects the target and the backplane, and the existing gaps will lead to a decrease in the bonding str...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P11/00
CPCB23P11/00
Inventor 王越徐学礼何金江刘红宾刘书芹李勇军
Owner GRIKIN ADVANCED MATERIALS
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