Preparation method of butyl rubber modified SIS hot-melt pressure-sensitive adhesive

Abstract

The invention discloses a preparation method of a butyl rubber modified SIS hot-melt pressure-sensitive adhesive. The method comprises the following steps: 1, adding a styrene-isoprene-styrene block copolymer SIS and butyl rubber in a weight ratio of 1:1 in a reactor, adding naphthenic oil 30 wt.% of the mixture, soaking for 6-8 h, adding 50% the petroleum resin, 50% terpene resin and 3% of zinc dibutyl dithiocarbamate; and 2, introducing nitrogen, heating to 120 DEG C, stirring until complete melting of the resin, heating to 160 DEG C, continuing stirring until the system becomes a transparent uniform viscous liquid, stopping the stirring, and discharging the material while hot to obtain a butyl rubber modified SIS hot-melt pressure-sensitive adhesive. The hot-melt pressure-sensitive adhesive provided by the invention does not contain organic solvent, is non-toxic, harmless and pollution-free, and has the advantages of higher cohesive strength than a solvent-type pressure sensitive adhesive, fast curing, wide bonding plane, simpleness to manufacture, convenience to use, and a wide range of usage.

Description

[0001] technical field [0002] The invention relates to a preparation method of a hot-melt pressure-sensitive adhesive, in particular to a preparation method of a butyl rubber modified SIS hot-melt pressure-sensitive adhesive. [0003] Background technique [0004] Pressure-sensitive adhesives are adhesives that can be bonded instantaneously with a slight pressure. Usually, there are emulsion methods, solvent methods, and hot-melt methods. Emulsion-type pressure-sensitive adhesives are prepared by emulsion copolymerization of acrylate and modified monomers, and then applying the emulsion to the substrate, and drying to remove moisture. There are problems such as slow drying, poor low-temperature adhesion, and trace residual monomer odor during production. Solvent-based pressure-sensitive adhesives use organic solvents as the medium. After coating, the organic solvents are removed by drying to make pressure-sensitive adhesives. The organic solvents volatilize into the atmo...

AI Technical Summary

Problems solved by technology

There are problems such as slow drying, poor adhesion at low temperature, and trace residual monomer odor during production

Solvent-based pressure-sensitive adhesives use organic solvents as the medium. After coating, the organic solvents are removed by drying to make pressure-sensitive adhesives. The organic solvents volatilize into the atmosphere to cause pollution, waste resources, and have high costs.