Junction temperature simulation circuit for semiconductor power devices
A technology for simulating circuits and power devices, used in instruments, thermometers and thermometers with electrical/magnetic components directly sensitive to heat, etc. Temperature protection power devices are difficult to apply safely, to achieve the effect of improving the safety and reliability of use
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[0014] figure 1 The basic thermal model in can be expressed as:
[0015] q = λA δ ( T 1 - T 2 ) - - - ( 1 )
[0016] Formula (1) is the basic formula for heat conduction, where:
[0017] q is the heat that flows through the heat conductor per unit time;
[0018] λ is the thermal conductivity of the heat conductor;
[0019] A is the heat conduction cross-sectional area of the heat conductor;
[0020] δ is the length along the direction of heat conduction in the heat conductor;
[0021] T1 and T2 are the temperatures of the two end sections of the heat conductor.
[0022] In the formula Represents the thermal conductance of the heat conductor (that is, the reciprocal of the thermal resistance, which can also be expressed as ), so ...
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