A heat dissipation structure applied to a computer processor

Abstract

The invention provides a heat dissipation structure for a computer processor. The heat dissipation structure is fixedly connected between a computer case shell and a processor. The heat dissipation structure comprises a plurality of heat conduction tubes, a shell fixing base for fixing the heat conduction tubes on the computer case shell, and a processor fixing base for fixing the heat conduction tubes on the processor. One end of each heat conduction tube is connected with the shell fixing base. The other end of each heat conduction tube is connected with the processor fixing base. Continuous increase of processor operation clock frequency causes high power consumption and high heat. The processor fixing base can transfer the heat to the heat conduction tubes, and then the shell fixing base can transfer the heat to the computer case shell, so that the processor can dissipate heat efficiently, and the working temperature of the processor is not affected by external environment. Normal operation of the process is guaranteed, so that the performance of the computer is improved. Furthermore, the computer can adapt to work with high environment requirement. The heat dissipation structure is simple, has a low cost, can save interior space of the computer, does not produce noise and has a good heat dissipation effect.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a heat dissipation structure applied to a computer processor. Background technique [0002] At present, the general computer processor radiator on the market is composed of a radiator and a cooling fan. The radiator is installed on the processor with a fastener, and the cooling fan is installed on the radiator and connected to the power supply. The high temperature on the surface of the processor is brought out, and the heat is immediately blown away by the cooling fan, so as to achieve the purpose of cooling the processor. The current problem is that with the continuous increase of the operating clock frequency of the processor, high power consumption and high heat will be generated at the same time, which will affect the stability and service life of the system products. So far, the best solution has not been found, and the volume of the radiator and cooling fan is forced to...

AI Technical Summary

Problems solved by technology

The current problem is that with the continuous increase of the operating clock frequency of the processor, high power consumption and high heat will be generated at the same time, which will affect the stability and service life of the system products. So far, the best solution has not been found, and the volume of the radiator and cooling fan is forced to be reduced. The bigger it gets, the more noise it produces

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