Succinimide silver plating solution and electroplating method
A succinimide and electroplating solution technology, applied in the field of silver plating process, can solve the problems of poor discoloration resistance of the coating, less than ideal weldability, and insufficient stability of the plating solution, and achieves good stability, anti-discoloration and Strong weldability, improved densification and smoothness
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Embodiment 1
[0037] The formula of succinimide silver plating bath is as follows:
[0038]
[0039] Plating process conditions: the pulse width of a single pulse square wave current is 1ms, the duty cycle is 20%, and the average current density is 0.3A / dm 2 ; The pH is 8, the temperature is 15°C, and the plating time is 60min.
Embodiment 2
[0041] The formula of succinimide silver plating bath is as follows:
[0042]
[0043] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 15%, and the average current density is 0.4A / dm 2 ; The pH is 8.5, the temperature is 20℃, and the plating time is 50min.
Embodiment 3
[0045] The formula of succinimide silver plating bath is as follows:
[0046]
[0047] Plating process conditions: the pulse width of a single pulse square wave current is 2ms, the duty cycle is 10%, and the average current density is 0.5A / dm 2 ; The pH is 9, the temperature is 25℃, and the plating time is 40min.
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