Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic device and electromagnetic wave shielding module thereof

An electronic device, electromagnetic wave technology, applied in the fields of magnetic field/electric field shielding, electrical components, grounding circuits, etc., can solve the problems of inability to go through the inner layer, the surface layer must be passed, and large noise, and achieve the effect of saving configuration space and manufacturing costs.

Active Publication Date: 2015-04-29
WISTRON CORP
View PDF14 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current electronic devices are designed towards the trend of thinner and lighter, and the internal configuration space is also reduced. For example, the area of ​​the motherboard of small-sized electronic devices (such as tablet computers) becomes smaller, so all electronic components are close to each other. Nearby, the noise is getting bigger and harder to suppress, and the motherboard often uses through holes instead of blind holes for wiring, so that the wiring cannot go through the inner layer but the surface layer, so it will also cause no traces on the surface of the motherboard. Sufficient space can be used to install electromagnetic wave shielding structures, so how to properly arrange heat sinks and electromagnetic wave shielding structures in the limited configuration space of electronic devices is an important issue in the design of current electronic devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device and electromagnetic wave shielding module thereof
  • Electronic device and electromagnetic wave shielding module thereof
  • Electronic device and electromagnetic wave shielding module thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] figure 1 It is a partial perspective view of an electronic device according to an embodiment of the present invention. figure 2 Yes figure 1 A perspective view of some components of the electronic device. image 3 Yes figure 1 A block diagram of some components of an electronic device. In order to make the drawings more clear, figure 1 only a partial area within the electronic device 100 is depicted, and figure 2 not shown figure 1 The heat dissipation fan 140, the heat pipe 150 and the locking part 160 in it. Please refer to Figure 1 to Figure 3 The electronic device 100 of this embodiment is, for example, a smart phone (smart phone), a tablet PC (tablet PC) or a notebook computer (notebook computer) and other devices and includes a circuit board 110, a heating element 120, an electromagnetic wave shielding module 130. A cooling fan 140 and a heat pipe 150. The circuit board 110 is, for example, a motherboard in the electronic device 100 and has a ground pla...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electronic device including a circuit board, a heat generating component and an electromagnetic wave shielding module is provided. The circuit board has a ground plane. The heat generating component is disposed on the circuit board. The electromagnetic wave shielding module includes a plurality of conductive components and a heat dissipating component. The conductive components are disposed on the circuit and electrically connected to the ground plane, wherein the conductive components are arranged with intervals and surround the heat generating component. The heat dissipation component is disposed on the heat generating component and connected to the conductive components, wherein the heat dissipating component covers and contacts with the heat generating component to dissipate heat from the heat generating component and shield an electromagnetic wave generated by the heat generating component, and the electromagnetic wave is transmitted to the ground plane and drained through the conductive components.

Description

technical field [0001] The invention relates to an electronic device and its electromagnetic wave shielding module, and in particular to an electronic device and its electromagnetic wave shielding module with heat dissipation function. Background technique [0002] In recent years, the operating speed of electronic devices such as smart phones, tablet PCs, and notebook computers has been continuously improved, and the heating power of electronic components in the electronic devices has also been continuously increased. . In order to prevent the temporary or permanent failure of the electronic components due to overheating, it is necessary to install cooling fins and other heat sinks on the electronic components to reduce the temperature of the electronic components. [0003] In addition, electromagnetic wave interference is one of the common problems inside electronic devices. In detail, the electronic components in the electronic device usually generate electromagnetic wa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K7/20
CPCH05K7/20509H05K9/0064
Inventor 雷竣翔朱博显陈建儒
Owner WISTRON CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com