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High-thermal-diffusion-coefficient high molecular material and preparation method thereof

A polymer material and diffusion coefficient technology, applied in the field of polymer materials and its preparation, can solve problems such as unsatisfactory, low thermal diffusivity, deviation of heat dissipation effect, etc., to improve heat conduction, improve interface performance, and reduce viscosity Effect

Inactive Publication Date: 2015-04-29
HUIZHOU KINGBALI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the thermal conductivity of the material can be improved to a certain extent by increasing the content of thermally conductive fillers in plastics. However, the widely used granular and sheet-shaped thermally conductive fillers can improve their thermal conductivity, but their thermal diffusivity is generally low. Deviation, unable to meet the application of some specific environments, especially in low temperature environments
[0006] In the prior art, there have been related reports on the preparation and performance of thermally conductive plastics, but there are few reports on the high thermal diffusivity modification technology of polymer plastic materials used for heat dissipation shells of LED lamps

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Example 1 According to the formula in Table 1, 5 different formula products (1#~5# in Table 1) were produced, and compared with the products produced by the formula (6#) without adding high thermal conductivity filler. Table 2 shows the physical property measurement results of 6 different products produced according to the formula in Table 1.

[0033] Table 1 Product formula table (unit: parts by weight)

[0034] .

[0035] The specific formula and preparation method adopted in the present embodiment are as follows:

[0036]1. Formula: matrix resin (translucent or opaque milky white granular polycaprolactam with a relative viscosity of 2.8), high thermal diffusion thermal conductivity filler (hexagonal boron nitride, thermal conductivity graphene, carbon nanotubes, spherical alumina by mass ratio 4: 1:1:15 for compounding), carbon fiber composite material (chopped carbon fiber with a length of 6-8um), toughening agent (SEBS grafted with maleic anhydride with a male...

Embodiment 2

[0047] Embodiment 2 adopts following formula and steps to realize the present invention:

[0048] 1. Formula: 60.5 parts of matrix resin (polyhexamethylene adipamide, acrylonitrile-butadiene-styrene copolymer), high thermal diffusion thermal conductivity filler (hexagonal boron nitride, thermal conductivity graphene, carbon nanotubes, spherical oxide Aluminum compounded according to the mass ratio of 5:1:2:12) 35.5 parts, carbon fiber composite material (microcrystalline graphite) 2 parts, toughening agent (maleic anhydride grafted POE) 8 parts, coupling agent (organic complex object coupling agent) 1 part, 0.5 parts of antioxidant 1098, 1 part of antioxidant 1076, 10 parts of other additives (5 parts of antistatic agent, 5 parts of lubricant);

[0049] 2. Preparation method:

[0050] (1) Put the high-thermal diffusion and heat-conducting filler into a high-speed mixer for high-speed mixing, and add 2% of its mass white mineral oil at the same time;

[0051] (2) Prepare a...

Embodiment 3

[0057] Embodiment 3 adopts following formula and steps to realize the present invention:

[0058] 1. Formula: 20 parts of matrix resin (industrial liquid crystal polymer, polypropylene), high thermal diffusion thermal conductivity filler (hexagonal boron nitride, thermal conductivity graphene, carbon nanotubes, magnesium oxide in a mass ratio of 4:1:1:15) 65 parts, carbon fiber composite material (microcrystalline graphite) 1 part, toughening agent (ethylene-vinyl acetate copolymer) 3 parts, coupling agent (aluminate coupling agent) 0.5 part, antioxidant 168 0.8 1.6 parts of antioxidant 1076, 2 parts of other additives (anti-dripping agent);

[0059] 2. Preparation method:

[0060] (1) Put the high-thermal diffusion and heat-conducting filler into a high-speed mixer for high-speed mixing, and add 1.5% of its mass white mineral oil at the same time;

[0061] (2) Prepare a water-absolute ethanol solution, the mass percentage of water in the solution is 6%; dissolve the couplin...

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PUM

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Abstract

The invention discloses a high-thermal-diffusion-coefficient high molecular material and a preparation method thereof. The high-thermal-diffusion-coefficient high molecular material is prepared from the following steps: 20-65 parts of matrix resin, 35-65 parts of high-thermal diffusion heat-conducting filler, 0.1-5 parts of carbon fiber composite, 0.1-10 parts of a flexibilizer, 0.1-2 parts of coupling agent, 0.1-2 parts of antioxidant and 0.1-15 parts of other auxiliaries. According to the high-thermal-diffusion-coefficient high molecular material, the heat conduction capability of the high molecular material is remarkably enhanced by virtue of the positive synergetic hybrid effect of a three-dimensional heat-conducting network formed by the high-thermal-diffusion-coefficient heat-conducting fillers different in shape in the processing course, and therefore the problems of poor heat conduction and thermal diffusion properties of the high molecular material for the existing LED lamp cooling housing are solved; in the preparation process, the compatibility between the surface modified high-thermal-diffusion-coefficient high molecular material and a resin matrix is improved, the viscosity of the synthetic resin melt is reduced and the dispersity of the filler is improved to enhance the processability; as a result, the product has excellent surface quality and mechanical properties; the high molecular material further has the advantages of high thermal conductivity and high tenacity.

Description

technical field [0001] The invention relates to a polymer material and a preparation method thereof, in particular to a high thermal diffusivity polymer material and a preparation method thereof, and belongs to the technical field of polymer materials and its preparation. Background technique [0002] As a green light source, LED has been widely used at present. In the field of LED lamp processing and manufacturing, if the LED lamp housing has poor heat dissipation, it will easily lead to damage to the power supply, accelerated light decay, and shortened life span. The heat dissipation performance of the heat dissipation shell material of LED lamps is always the top priority in the performance improvement of LED lighting systems. [0003] The thermal diffusivity is a physical quantity that reflects the temperature homogenization speed in an object with uneven temperature. The thermal diffusivity is related to the thermal conductivity of the object and the heat required to i...

Claims

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Application Information

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IPC IPC(8): C08L77/02C08L77/06C08L81/02C08L67/02C08L71/08C08L55/02C08L23/12C08K13/06C08K3/34C08K7/18C08K3/22C08K3/28C08K3/38C08K7/24C08K3/04C08K7/06B29C47/92B29C48/92
CPCC08L77/02B29C48/92B29C2948/9258B29C2948/92704C08K2201/003C08K2201/011C08L23/12C08L55/02C08L77/06C08L2201/08C08L2205/03C08L51/00C08K13/06C08K9/06C08K2003/385C08K3/04C08K7/24C08K2003/2227C08K7/06C08L51/06C08K9/04C08L23/0853C08K2003/222C08L53/025C08K3/34
Inventor 杨永佳张彦兵杨小义
Owner HUIZHOU KINGBALI TECH
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